Electronics Forum | Tue Dec 26 22:18:20 EST 2006 | davef
Common methods to replate components are: * Barrel plating http://www.finishing.com/Library/zemo/barrel.html * Hot solder dipping - MIL-F-14072 M258 Certainly you can do this yourself by dipping the component leads into a solder pot containing lead
Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
| https://www.eptac.com/wp-content/uploads/2020/02/eptac_webinar_03-18-20.pdf
” 4 J-STD-001/610 • Tin mitigation plan according to GEIA- STD-0005-2 will be necessary, or have some plan identifying how it is being handled by the industry • The question is
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