Industry Directory | Manufacturer
We are manufacturer of 2K potting technology AB glue dispensing machine Epoxy dispensing machine Two-component dispensing machine，Dual-component dispensing machine Meter-mix dispensing machine，Resin dispensing machine
Industry Directory | Manufacturer
The Future of Electronics is here - With Squink at your Desktop, print and assemble PCBs in minutes instead of weeks for less than a cup of coffee. Go from CAD design to PCB without the pain and cost.
New Equipment | Assembly Services
Detailed introduction of 3D spi-7500 solder paste thickness gauge Product function Fast programming, friendly programming interface 1. Multiple measurement methods 2. True one button measurement 3. Eight square movement button, one key foc
New Equipment | Assembly Services
Detailed introduction of 3D spi-6500 solder paste thickness gauge Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent
Electronics Forum | Mon Sep 03 03:32:47 EDT 2001 | johnw
Franky, what method are you using for printing glue? metal stencil or plastic?, and is it on contact or off contact ? and what type of squeegee's are you using? basically give us more infomation. In term's of measuring height / volume, you can do t
Electronics Forum | Tue Feb 08 12:36:28 EST 2000 | Charlie
I'm looking for information from both those who do cure glue and reflow past with the same profile and those who have tried and decided against it. What were the problem? What are the limitations?
Used SMT Equipment | Soldering - Reflow
Newly-designed low-height lid is adopted on Heller 1936 MK7, simplifying the operation and maintenance, reducing the temperature of the surface, and saving energy. The vertical curing oven developed by Heller is available to replace the traditional
Industry News | 2008-03-19 14:49:56.0
Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will showcase RO300FC-C full convection reflow oven with RO-CONTROL software in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2008-08-11 20:32:24.0
Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will showcase RO300FC-C full convection reflow oven with RO-CONTROL software in booth 211 at the upcoming SMTA International 2008 exhibition and conference, scheduled to take place August 19-20, 2008, in Orlando, FL.
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Parts & Supplies | Assembly Accessories
12MM Calibration Tape .12MM Calibration Tape 20 Inch Folding Bike Ravel Case 20 Inch Folding Bike ravel Case 4*4.1200pcs/bag M0604 8MM Calibration Tape .8MM Calibration Tape 90 degree drive set 90 degree drive set A2E BGA Rework Station Temp Con
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Parts & Supplies | Pick and Place/Feeders
03090055S01 Pulse counter CUB7CCS0 8-digit 03090079-01 cover fan protective grid 03090149-01 PCB Power adjust HCS II cpl. 03090669-01 replacement pin, multiframe splice 2,5mm 03090670-01 replacement pin, multiframe splice 2,0mm 03090712-01 Stop-
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
ETA Online Jet Dispensing Machine D400 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Dispensing Machine,SMT Glue Dispensing Machine,Dispe
I.C.T PCB LED Dispensing Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt,Dispensing Machine,SMT Glue Dispensing Machine,Dispensing
Career Center | Wroclaw, Poland | Engineering
Certified IPC Specialist (CIS) IPC-A-610D Honeywell SPOC online training Six Sigma Lean Manufacturing Training Certificate FUJI CP-6 and NXT training: Operating, Maintenance, Programming I can program SMT Fuji machines using Flexa software, maintain
Career Center | , India | Engineering,Maintenance,Production,Technical Support
Hands on experience in PLC based machine, DEK Printer Machine, Camlot Glue dot machine, Fuji NXT, SPI machine, reflow: Vitronics XPM2/3, Expertise in SMT Profiling Qualification & NPI Build, Soldering defects, Analysis & rework. Line modifi
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China GOLDLAND ELECTRONIC TECHNOLOGY CO., LIMITED company profile Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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Glue Potting Machine from China, Glue Potting Machine Manufacturer & Supplier - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch
