Industry News: go 60 spindles (Page 1 of 10)

CirTran Further Expands Domestic Sales Capacity to Over 40 Representatives

Industry News | 2003-03-12 08:14:19.0

Today announced the addition of two leading electronics sales representative firms designed to increase CirTran's domestic sales volume.

SMTnet

Circuit Board Burnouts

Industry News | 2003-03-31 09:31:11.0

Electronic contract manufacturers face tough realities

SMTnet

KEMET Announces Enhanced Strategic Plan

Industry News | 2003-07-10 08:36:25.0

To execute this strategic plan, KEMET is reorganizing its operations around the world.

SMTnet

Count On Tools Inc. Releases Interchangeable Cup Nozzles for Universal Equipment

Industry News | 2012-04-27 15:25:26.0

Count On Tools Inc., a leading provider of precision components and SMT spare parts, has released a series of interchangeable cup nozzles for Universal Instruments’ Flexjet 2/3/Inline 7 (7 Spindle) equipment.

Count On Tools, Inc.

SMTA Announces Upcoming Webinars

Industry News | 2010-02-18 21:26:02.0

Minneapolis, MN - The SMTA is pleased to announce several new webinars coming up in March. Webinars are 60 to 90 minute online presentations comparable to a conference session. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2015-08-16 09:43:18.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.

Surface Mount Technology Association (SMTA)

IPC Hand Soldering Competition to Heat Up SMT Hybrid Packaging 2016

Industry News | 2016-03-08 16:25:52.0

IPC’s Hand Soldering Competition at SMT Hybrid Packaging 2016 will see skilled competitors go soldering iron to soldering iron, April 26-28, as they compete for cash prizes and a coveted spot at the IPC Hand Soldering World Championship at IPC APEX EXPO® in San Diego in 2017.

Association Connecting Electronics Industries (IPC)

IPC Hand Soldering Competition to Heat Up SMT Hybrid Packaging 2017

Industry News | 2017-03-09 14:31:25.0

IPC’s Hand Soldering Competition at SMT Hybrid Packaging 2017 will see skilled competitors go soldering iron to soldering iron, May 16-18, as they compete for cash prizes and a coveted spot at the IPC Hand Soldering World Championship located in Munich, Germany, this November.

Association Connecting Electronics Industries (IPC)

IPC Releases New Industry Statistics

Industry News | 2001-12-12 07:28:23.0

IPC has announced the creation of the PCB Business Report, a new IPC statistical report tracking the dynamics of the U.S. Printed Circuit Board industry. The PCB Business Report, scheduled to be published for the first time on February 28, 2002, will be presented monthly, in addition to the IPC Book-to-Bill ratio.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference Moving Toward Largest Program in Its History

Industry News | 2008-08-14 14:03:27.0

San Jose, CA � This year's fifth annual International Wafer-Level Packaging Conference (IWLPC), October 13-16, will be the largest ever, according to Dr. Ken Gilleo, IWLPC general chair.

Surface Mount Technology Association (SMTA)

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