New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Fabrication Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board
New Equipment | Fabrication Services
0.15mm FR4 1oz Immersion gold For memory card/SD card/Flash Card akenzhang@hrxpcb.cn
Manufacture capability Layers: 1-16 layers Materials: CEM1, CEM3, Teflon, Rogers,FR-4, High Tg FR-4, Aluminum Base, Halogen Free Max. Board Size: 510*1200mm Material: RoHS Directive-compliant PCB thickness: 1.6 ±0.1mm Out Layer Copper Thickn
New Equipment | Fabrication Services
Project Description | Parameters 4 Layer Thickness: 0.25+/-0.1 mm Min Hole Size: 0.3 mm Width/Space: 0.2mm/0.15 mm Surface Treatment: Flash Gold plating | Craft Flash Gold plating Different Thickness Stiffener Lamination | Application Power Hat C
Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com. ItemCapability Production TypeAlum PCB/Multilayer PCB 1-14L LaminationFR4. CEM-3. Halogen Free PCB ThicknessInner layer: min 0.1mm outer layer: 0.2-3.2mm Copper ThicknessH/
New Equipment | Assembly Services
Lead Time For Production Orders: Sample Lead time(days) Mass production lead time(days) Single sided PCB 1~3 4~7 Double si
New Equipment | Assembly Services
Lead Time For Production Orders: Sample Lead time(days) Mass production lead time(days) Single sided PCB 1~3 4~7 Double si
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
1��Materials��FR-4��CEM-1�� High-Tg170, Teflon, Aluminum-base, Iron-base 2��Layers: Single, Double Side, Multi Layers (Less than 22 Layers) 3��Finished Surface: HAL,Lead Free HAL, Immserion Gold,Plating Flash Gold, O.S.P., Gold-Finger, Carbon Ink, P
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
