Electronics Forum | Tue Dec 10 05:03:58 EST 2002 | praveen
We are having solder fillet finish issue. The solder looks like rough solder on the connector leads .The plating of the leads is Nickel (99.9% purity) and the PCB plating is imersion gold. I have tried fine tuning my reflow profiles an have used N2 i
Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ
Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to
Electronics Forum | Mon Dec 06 05:18:53 EST 1999 | Wolfgang Busko
Hi Russ, assuming that only your flux changed and the PCB-finish stayed the same it seems to me that the solderability of that finish is somehow poor. About Ni/Au it can be said that the solderconnection is made between Ni and Sn. The Au-finish is ju
Electronics Forum | Mon Mar 20 09:24:38 EST 2000 | John Sipper
1. Spec references for max allowable untinned gold near glass seal and case body? 2. Low cost mechanical dip system to facilitate tinning of DIP parts. (Low volume; currently using hand solder iron techniques to allow for max coverage without bridg
Electronics Forum | Sun Mar 18 23:01:11 EDT 2007 | diesel_1t
Hi there, I want help on the following issue. Where I work, we place a component QFP 256 terminals (20 mil pitch)from hitachi (renesas), we use a MPM UP-3000 screen printer, IP-III placement machine and Vitronics 8 zones reflow Oven. lead plating
Electronics Forum | Mon Jun 12 07:42:56 EDT 2006 | brian.perry@suntroncorp.com
We are placing a gold plated device (LCC) to a NiAu PCB using a SnPb No-clean solder. We're noticing quite a bit of difficulty with reliable joints (intermittent connectivity) and if we have to rework a particular device, adjacent devices of this sa
Electronics Forum | Tue Jan 13 22:43:11 EST 2004 | davef
We have seen this in reflowed parts, where there is flux res collected in the dimple in the solder, where the lead 'presses' in the solder. Generally, we attack this as a thermal issue: * Thermal pads sucking the heat away from the leads. * Leads no
Electronics Forum | Wed Jan 14 10:07:38 EST 2004 | Patrick
More on QFP soldering issue as per Paul f original e-mail. 1. Problems occured on different PCB's, on different lines using different equipment 2. Flux residue is common in the dimple on the solder. 3. The fault occurred using both "Kester 265" & "Al
Electronics Forum | Tue Mar 21 20:25:30 EST 2000 | Dave F
John: What�s the matter? Free gold � good thing for you, bad thing for your supplier. :^) Pre-tinning of gold plated leads is important to: � Prevent gold embrittlement of the solder joint � Determine if the leads are solderable prior to assembly (
Electronics Forum | Thu Jan 08 15:03:40 EST 2004 | dwzeek
We have an ongoing problem with our QFP144 packages soldering. It has not received much attention until late due to some customer failures. Most of the failures would show up in ESS testing and be repaired. The failure rate is about 2 in 1000 parts f
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