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: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
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SolderTips: Solderability Issues with Nickle Plated Surfaces - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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] or more of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c. From the surfaces to be soldered of solder terminals plated with
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
] or more of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c. From the surfaces to be soldered of solder terminals plated with
| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. The other issue with solder paste is the function of the flux. In plated through hole soldering the flux is used to prepare the component leads and the circuit board prior to soldering
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: This printed layer contains labels, symbols, and markings for components. Vias: Small holes drilled through the PCB, often plated with copper. Pads
| https://www.eptac.com/faqs/soldertips/soldertip/solder-paste-shelf-life-and-testing
. The other issue with solder paste is the function of the flux. In plated through hole soldering the flux is used to prepare the component leads and the circuit board prior to soldering
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stay in place during the soldering process. Why does the IPC not recommend creating this type of splice? Read Answer SolderTips: Solderability Issues with Nickle Plated Surfaces Question
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stay in place during the soldering process. Why does the IPC not recommend creating this type of splice? Read More SolderTips: Solderability Issues with Nickle Plated Surfaces General Tip Question
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