Industry Directory: grids (41)

Ovation Products

Industry Directory | Manufacturer

Pioneer of numerous productivity enhancing tools designed to optimize SMT electronic equipment and processes. Innovator of the award-winning Grid-Lok, Magna-Print and Stinger technologies.

ATO Inverter

Industry Directory | Manufacturer's Representative

Inverter.com is a branch online store of ATO USA, specializing in the sales and technical service of 12V/24V/48V pure sine inverters, grid-connected/off-grid solar inverters, solar water pumps etc.

New SMT Equipment: grids (88)

BGA Reballing Service

BGA Reballing Service

New Equipment | Rework & Repair Services

BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

BGA Rework Services

BGA Rework Services

New Equipment | Rework & Repair Services

BGA Rework Services Offered  BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

Electronics Forum: grids (381)

Why 50 mils in 0805 package instead of 40 mils.

Electronics Forum | Fri Oct 10 19:24:53 EDT 2003 | MA/NY DDave

Hi SMTAnet, SMTnet, You already got good answers for how to go forward. I believe that this 50mils is a remnant of the days when we started at 125 mil grids and started the process of going down to 100mil grids, SMT. My gosh who would ever want a 1

BGA and PGA

Electronics Forum | Sat Jul 29 02:46:33 EDT 2006 | rogerw_tech

hi everyone what does ball grid array and pin grid array mean? thank

Used SMT Equipment: grids (71)

MPM Momentum+ Printer

MPM Momentum+ Printer

Used SMT Equipment | Screen Printers

MPM Momentum+ Printer Substrate treatment                                                       Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite  457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DEK Horizon 02

Used SMT Equipment | Screen Printers

Max PCB Size: 508*508 Camera/Vision System : Green digital camera Camera res.: FOV 5x8.5 mm Tooling: Grid Lock/Magnetic

Salescon Ltd.

Industry News: grids (314)

'T' Series Bi-Metal Cutouts

Industry News | 2003-04-04 07:39:52.0

Designated T11L these have soldered connections for PCB circuits with a grid of 0.2 pitch

SMTnet

Connector Range has Board-to-cable Options Covered

Industry News | 2003-03-13 08:19:18.0

The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.

SMTnet

Parts & Supplies: grids (88)

DEK Steel grid (new) of DEK

DEK Steel grid (new) of DEK

Parts & Supplies | SMT Equipment

Steel grid (new) of DEK Size: 580 * 580 Applicable models:DEK Printing Machines

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: grids (41)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Underfill Materials Dispensing in Electronics Manufacturing Applications

Technical Library | 2024-08-20 00:40:08.0

In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.

GPD Global

Videos: grids (33)

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Videos

Amid the COVID 19 crisis, Precision PCB Sevices, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern Californa and Dallas, Texas. Today are introducing our new Side View Camera for BGA Rework

Precision PCB Services, Inc

Flux spray coating on PCB with DispenseJet DJ-2200

Flux spray coating on PCB with DispenseJet DJ-2200

Videos

Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.

ASYMTEK Products | Nordson Electronics Solutions

Training Courses: grids (3)

Solder Training & Certification Course Taught

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Events Calendar: grids (16)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: grids (10)

Advanced Manufacturing Technology Engineer

Career Center | Space Coast, Florida USA | Engineering,Research and Development

Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit

Priority Search

Senior Advanced Packaging Engineer

Career Center | Melbourne, Florida USA | Engineering

Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi

Harris Corporation

Career Center - Resumes: grids (5)

EMS-PCBA/PCA Process/Quality (Six sigma Black belt)

Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support

· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

Express Newsletter: grids (76)

SMTnet Express March 14 - 2013, Subscribers: 26245

-off-the-shelf ball/column grid array packaging (COT

Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment

Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment by: Jim Hines, Adam Stanczak

Partner Websites: grids (80)

Grid for Part Creation and Placement - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/grid-for-part-creation-and-placement_topic2533_post10423.html

. The Part Placement Grids are 1 mm for large parts, 0.5 mm for medium size parts and 0.1 mm for small parts. For PCB layouts that have High Density part placements, the best PCB library "Pad Size Round-off" and "Pad Place Round-off" grid would be 0.01 mm

PCB Libraries, Inc.

3 Ways IoT is Revolutionizing the Energy Industry

| https://www.eptac.com/blog/3-ways-iot-is-revolutionizing-the-energy-industry

. Power companies will automatically have a better idea why certain grids are going down and can create prediction models, allowing them to devise better responses to power outages


grids searches for Companies, Equipment, Machines, Suppliers & Information

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Thermal Interface Material Dispensing

Training online, at your facility, or at one of our worldwide training centers"
best pcb reflow oven

High Resolution Fast Speed Industrial Cameras.
High Throughput Reflow Oven

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Win Source Online Electronic parts

Software for SMT placement & AOI - Free Download.