Industry Directory: heat cure (11)

IRphotonics

Industry Directory | Manufacturer

IRphotonics is a leader in the design, manufacture, and marketing of Infrared-based materials and systems.

ETS, LLC

Industry Directory | Manufacturer

Manufacturer of Solder Reflow and Curing Ovens

New SMT Equipment: heat cure (53)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Lead-Free Desktop Reflow Oven with tempereture cure T200N+

Lead-Free Desktop Reflow Oven with tempereture cure T200N+

New Equipment | Reflow

Lead-Free Desktop Reflow Oven with tempereture cure T200N+ Lead-Free Desktop Reflow Oven with tempereture cure T200N+ Product Description Product Description: T200N+=nitrogen lead free reflow oven T200N+temperature tester  T200N+ is not o

Beijing Torch Co.,Ltd

Electronics Forum: heat cure (196)

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 21:21:10 EST 2001 | davef

Gary: It doesn't matter what you use to cure your glue. SMA adhesives are thermosets. This means they become hard on cure and this is not reversible. A couple of things go on with SMA adhesives when you heat them. * Their rheology is temperature

Re: Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Thu Jun 24 11:41:10 EDT 1999 | John Thorup

| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel

Used SMT Equipment: heat cure (13)

Essemtec 2022 Essemtec RO300FC Reflow O

Essemtec 2022 Essemtec RO300FC Reflow O

Used SMT Equipment | Soldering - Reflow

2022 Essemtec RO300FC Reflow Oven Demo Never Used in Production Reflow Oven The Essemtec RO300FC is a full convection reflow oven designed for the reflow soldering of lead-free solder pastes and the curing of adhesives. Here are some key features

Parker SMT

Speedline OmniExcel 10 ....under 20k

Speedline OmniExcel 10 ....under 20k

Used SMT Equipment | Soldering - Reflow

Speedline Electrovert Omnimax 10 Oven Manufactured Year: 2012 Voltage: 380, 3 Phase 10 Zones Oven, Top and Bottom Heated Length: 3.855 mm 3 Cooling Zone Cooling Length: 1.293 mm Reflow Operating Temperature: 350 C Curing Operating Tem

smtXtra

Industry News: heat cure (141)

Heller Industries Mark 5 Wins 2012 VISION Award

Industry News | 2012-05-11 20:35:45.0

Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.

Heller Industries Inc.

Heller Industries Commended by Frost & Sullivan for Delivering Unmatched Customer Value through Its Reflow Soldering Technology

Industry News | 2019-12-09 14:44:26.0

The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.

Heller Industries Inc.

Parts & Supplies: heat cure (1)

Precision Valve & Automation (PVA) PVA IR2000 Heating Element Ogden FP2146 6-0

Precision Valve & Automation (PVA) PVA IR2000 Heating Element Ogden FP2146 6-0

Parts & Supplies | Coating and Encapsulation

PVA IR2000 Heating Element Ogden FP2146 6-0. Condition is used. 2925W 230/460VAC 3 Phase Power Meters good, decommissioned from a Precision Valve and Automation IR2000 Conformal Coating Curing Oven 24"x24"x1.5" As pictured Contact

Assured Technical Service LLC

Technical Library: heat cure (3)

Thermal Curing of Conformal Coatings

Technical Library | 2015-07-27 16:58:29.0

When it comes to the application of conformal coating, curing the coating plays a key role in the circuit assembly and selective conformal coating process. Curing conformal coating occurs after the coating spray/dispense process is complete. The coating is considered “cured” when the conformal coating on the circuit assembly is sufficiently tack-free to be handled. Curing can sometimes be accomplished at room temperature but takes a considerable amount of time to dry. Accelerated conformal coating curing decreases this drying period, the cure process reaches either the tack-free or a fully dried state but not quite having fully cured properties. Accelerated curing techniques include one or a combination of heat, moisture, UV light, and chemical reaction curing. This article focuses primarily on thermal or heat curing.

ETS - Energy Technology Systems, Inc.

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

Technical Library | 2011-09-22 16:30:11.0

The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens).

IRphotonics

Videos: heat cure (51)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

ICM -2200 Infrared paint curing oven for Drying Curing the UV Paint

ICM -2200 Infrared paint curing oven for Drying Curing the UV Paint

Videos

General of machine: 1.The in line curing machine (ICM Series) is idea for high volume curing production.They are easy to integate with different Conformal Coating machines. 2.Available in different lengths,they provide the flexibility to match your

Shenzhen Honreal Technology Co.,Ltd

Career Center - Jobs: heat cure (1)

Manufacturing Engineer, Process Engineer, Aerospace Structures

Career Center | , Mississippi USA | Engineering,Production

About The Company: This company is a supplier of aerospace and defense products to the U.S. Government and its allies and major prime contractors. This company holds market leadership positions in munitions, smart weapons and precision capabilities

PASS Network

Express Newsletter: heat cure (266)

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives Thermal Spot Curing of Adhesives with Photonic Energy; A novel fiber delivery

Partner Websites: heat cure (183)

Pressure Cure Oven (PCO)

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2019/08/pressurecureoven.pdf

Pressure Cure Oven (PCO) Pressure Cure Oven (PCO) System Overview  Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications

Heller Industries Inc.

Hot Melt Dispensing

GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-hotmelt-application.php

. Masking materials can also be formulated as a hot melt. Hot melt is an excellent choice because it solidifies rapidly when fluid temperature decreases to ambient, thus eliminating the extra steps of air cure, UV cure, and oven heat cure typically required

GPD Global


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