Partner Websites: heat cycles (Page 1 of 7)

Reliability of Reworked Lead-free Assemblies - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/reliability-of-reworked-lead-free-assemblies/

) and three repairs for a total of five heat cycles. This was all based upon the work done by Roger Wild from IBM. With the denser boards of today and the surface mount process, there are more thermal excursions due to components on both sides of the board, hence we have to be careful as to how and when we heat

SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC

| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/

. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack

Twin-Barrels | Nordson POLYMER PROCESSING SYSTEMS

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/barrels/twin-barrels

most complex applications for all resins High quality proprietary backing steel for less inherent stress, better straightness during heat cycles for the ultimate in strength and straightness Computer

ASYMTEK Products | Nordson Electronics Solutions

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/

. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components

. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack

Injection Barrels | Nordson POLYMER PROCESSING SYSTEMS

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/barrels/injection-barrels

 from general purpose to the most complex applications for all resins High quality proprietary backing steel for less inherent stress, better straightness during heat cycles for the ultimate in strength and straightness

ASYMTEK Products | Nordson Electronics Solutions

Extrusion Barrels | Nordson POLYMER PROCESSING SYSTEMS

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/barrels/extrusion-barrels

most complex applications for all resins High quality proprietary backing steel for less inherent stress, better straightness during heat cycles for the ultimate in strength and straightness Computer

ASYMTEK Products | Nordson Electronics Solutions

C-TurnFlux

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems/c-turnflux

. A motorized, five position indexer offers high speed product handling and a guaranteed position repeatability. The heating process is easy programmable by using Pulsed Heat Technology

ASYMTEK Products | Nordson Electronics Solutions

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