Industry Directory: heat stake process (48)

Process Technology

Industry Directory | Other

Process Technology is a wet process heating and cooling equipment manufacturer offering electric immersion heaters, inline heaters, heat exchangers, and temperature and level controls.

C-Tech Systems, B.V. [formerly Nordson DIMA]

Industry Directory | Consultant / Service Provider / Manufacturer

C-Tech Systems, B.V. [formerly Nordson DIMA] supplies Hot Bar Bonding and Soldering equipment that is supported by a global service network. We offer customer-inspired solutions in a range of industries.

New SMT Equipment: heat stake process (395)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Electronics Forum: heat stake process (971)

heat resistant glass plate

Electronics Forum | Wed Jul 17 03:23:09 EDT 2013 | vishnudas123

Dear All, can please tell specifications of heat resistant glass plate which is used to flux application and process control of wave soldering. can you tell the suppliers of the same in India. BR, Gupta.

BGA Rework (Top side heat only!)

Electronics Forum | Tue Feb 24 17:16:11 EST 2015 | grauen06

I was handed the task to develop a process to solder a BGA using topside heat only. It is a long story so I will spare the details, but I was wondering if anyone has ever attempted this? I have been going at it for a few weeks with fair results, but

Used SMT Equipment: heat stake process (108)

Ersa Versaflow 3/45

Ersa Versaflow 3/45

Used SMT Equipment | Soldering - Selective

This machine will be coming available for purchase soon. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: Version

Baja Bid

Juki W620 Flex Solder

Juki W620 Flex Solder

Used SMT Equipment | Soldering Equipment/Fluxes

Model:  FlexSolder W620 Vintage: 2012 (demo’ed only, never used!) Description:  Inline soldering system.  (With servo driven XYZ gantry, and tilt able gripper from 0° to 7° degrees for direct PCB handling) Details: •        Spray fluxer •       

Lewis & Clark

Industry News: heat stake process (992)

Heller Industries Commended by Frost & Sullivan for Delivering Unmatched Customer Value through Its Reflow Soldering Technology

Industry News | 2019-12-09 14:44:26.0

The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.

Heller Industries Inc.

Advances in Heated Dispense Process

Industry News | 2016-06-27 14:59:09.0

GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.

GPD Global

Parts & Supplies: heat stake process (74)

KIC  furnace temperature tester KIC START

KIC furnace temperature tester KIC START

Parts & Supplies | Assembly Accessories

Advantages of KIC START Cheap price. The temperature curve can be drawn quickly and accurately. Immediate and objective temperature curve analysis Easy to use software Manual temperature curve prediction Reliable and secure hardware 24-Hour cu

KingFei SMT Tech

Panasonic Panasonic bm123 BM221 0402 0603 0805 M ML

Panasonic Panasonic bm123 BM221 0402 0603 0805 M ML

Parts & Supplies | SMT Equipment

Panasonic bm123 BM221 0402 0603 0805 M ML Parameters: Brand:panasonic Type:0402 0603 0805 M ML nozzle Application:bm123 BM221 smt machine Nozzle advantage: 1.The body adopts imported material, processing and heat treatment, durable. 2.The no

KingFei SMT Tech

Technical Library: heat stake process (37)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

Staking/Epoxy Adhesive Dispensing for Aerospace

Technical Library | 2023-08-16 18:48:50.0

One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"

GPD Global

Videos: heat stake process (174)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

HELLER INDUSTRIES Presents: 1936 MKV Vacuum Reflow Oven

HELLER INDUSTRIES Presents: 1936 MKV Vacuum Reflow Oven

Videos

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

Training Courses: heat stake process (6)

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: heat stake process (7)

IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together

Events Calendar | Tue Apr 02 00:00:00 EDT 2019 - Tue Apr 02 00:00:00 EDT 2019 | King of Prussia, Pennsylvania USA

IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together

Association Connecting Electronics Industries (IPC)

Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization

Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,

Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization

Surface Mount Technology Association (SMTA)

Career Center - Jobs: heat stake process (16)

Mechanical Design Engineer - Western NY

Career Center | Rochester, New York USA | Engineering

Our high tech client located in the Western NY State area offers you the following challenge. Complete mechanical design responsibility from specification to the manufacturing process. We seek a candidate that has the following experience: Design

Cochran, Cochran, & Yale

Project Engineer

Career Center | Dallas, Texas USA | Engineering

Skills/Requirements: Ability to handle compliance issues NEBS, EMI/EMC UL and various customer requirements, required to handle first product builds, BOM's and ECO's. Duties/Functions: Taking requests for new products and coordinating new development

EMSR, Inc.

Career Center - Resumes: heat stake process (9)

Electronics Manufacturing

Career Center | Brookfield, ALL USA | Management,Production

Training and Qualifications Mil standards 464 Mil Standards 2000 ESD Training Cellular Manufacturing TQM Totally Quality Manufacturing ISO 9000 and 9001 IPC Standards, IPCA-610 IPC-J-STD-001E OSHA training LEAN Manufacturing, JIT (Just In T

Boise Resume

Career Center | , | 2011-11-16 09:17:11.0

Mil standards 464, Mil Standards 2000, ESD Training, Cellular Manufacturing, TQM Totally Quality Manufacturing, ISO 9000 and 9001 IPC Standards, IPCA-610, IPC-J-STD-001E, OSHA training, LEAN Manufacturing, JIT (Just In Time) Six Sigma, AS400 Systems

Express Newsletter: heat stake process (985)

Partner Websites: heat stake process (1328)

High Temperature PCB: Considerations for High-Heat Applications

Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/

: heat distribution, and materials that are able to withstand extreme heat. Because materials play such a critical role in this type of PCB design, the process is also known as High-Tg PCB manufacturing, and requires expertise in thermal design

Imagineering, Inc.

Multiple Mount Process View Camera

GPD Global | https://www.gpd-global.com/pdf/doc/Multiple-Mount-Process-View-Camera-User-Guide-22200620.pdf

Multiple Mount Process View Camera Lipstick Camera Multiple Mount Process View For Camera Models: 22101482, 22101482-0001, 22101482-0003, 22293271, 22293271-0001 Introduction The Multiple Mount Process View Lipstick Camera enables the operator to view operations at either two or three head

GPD Global


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