Industry Directory: heat stake process (41)

Process Technology

Process Technology

Industry Directory | Other

Process Technology is a wet process heating and cooling equipment manufacturer offering electric immersion heaters, inline heaters, heat exchangers, and temperature and level controls.

C-Tech Systems, B.V. [formerly Nordson DIMA]

C-Tech Systems, B.V. [formerly Nordson DIMA]

Industry Directory | Manufacturer of Assembly Equipment / Assembly / Soldering / Tape and Reel Services

C-Tech Systems, B.V. [formerly Nordson DIMA] supplies Hot Bar Bonding and Soldering equipment that is supported by a global service network. We offer customer-inspired solutions in a range of industries.

New SMT Equipment: heat stake process (5461)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

New Equipment | Reflow

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

Electronics Forum: heat stake process (956)

heat resistant glass plate

Electronics Forum | Wed Jul 17 03:23:09 EDT 2013 | vishnudas123

Dear All, can please tell specifications of heat resistant glass plate which is used to flux application and process control of wave soldering. can you tell the suppliers of the same in India. BR, Gupta.

BGA Rework (Top side heat only!)

Electronics Forum | Tue Feb 24 17:16:11 EST 2015 | grauen06

I was handed the task to develop a process to solder a BGA using topside heat only. It is a long story so I will spare the details, but I was wondering if anyone has ever attempted this? I have been going at it for a few weeks with fair results, but

Used SMT Equipment: heat stake process (90)

Speedline Speedline Bravo 8105

Speedline Speedline Bravo 8105

Used SMT Equipment | Soldering - Reflow

Configuration: ● edge/mesh ● Dual Air cooling zones ● left to right transfer ● chain oilers ● SMEMA VERSATILE, DURABLE, HIGH-PERFORMANCE REFLOW AT A VERY COMPETITIVE PRICE The Bravo 8105 is a forced convection reflow oven with eight top an

Capital Equipment Exchange

Heller Heller 1912EXL Reflow Oven  Pb Free

Heller Heller 1912EXL Reflow Oven Pb Free

Used SMT Equipment | Soldering - Reflow

Configuration ● Water cooled for superior cooling performance (includes chiller) ● edge/mesh conveyance ● left to right transfer ● flux management system ● Pure Forced Convection Heating ● Advanced Windows Operating system with Data Logging.

Capital Equipment Exchange

Industry News: heat stake process (828)

Heller Industries Commended by Frost & Sullivan for Delivering Unmatched Customer Value through Its Reflow Soldering Technology

Industry News | 2019-12-09 14:44:26.0

The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.

Heller Industries Inc.

Advances in Heated Dispense Process

Industry News | 2016-06-27 14:59:09.0

GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.

GPD Global

Parts & Supplies: heat stake process (74)

KIC  furnace temperature tester KIC START

KIC furnace temperature tester KIC START

Parts & Supplies | Assembly Accessories

Advantages of KIC START Cheap price. The temperature curve can be drawn quickly and accurately. Immediate and objective temperature curve analysis Easy to use software Manual temperature curve prediction Reliable and secure hardware 24-Hour cu

KingFei SMT Tech

Panasonic Panasonic bm123 BM221 0402 0603 0805 M ML

Panasonic Panasonic bm123 BM221 0402 0603 0805 M ML

Parts & Supplies | SMT Equipment

Panasonic bm123 BM221 0402 0603 0805 M ML Parameters: Brand:panasonic Type:0402 0603 0805 M ML nozzle Application:bm123 BM221 smt machine Nozzle advantage: 1.The body adopts imported material, processing and heat treatment, durable. 2.The no

KingFei SMT Tech

Technical Library: heat stake process (480)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Technical Library | 2020-01-28 00:23:58.0

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Heller Industries Inc.

Videos: heat stake process (107)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Videos

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

Training Courses: heat stake process (6)

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: heat stake process (13)

IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together

Events Calendar | Tue Apr 02 00:00:00 EDT 2019 - Tue Apr 02 00:00:00 EDT 2019 | King of Prussia, Pennsylvania USA

IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together

Association Connecting Electronics Industries (IPC)

Electronics in Harsh Environments Conference

Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands

Electronics in Harsh Environments Conference

Surface Mount Technology Association (SMTA)

Career Center - Resumes: heat stake process (9)

Electronics Manufacturing

Career Center | Brookfield, ALL USA | Management,Production

Training and Qualifications Mil standards 464 Mil Standards 2000 ESD Training Cellular Manufacturing TQM Totally Quality Manufacturing ISO 9000 and 9001 IPC Standards, IPCA-610 IPC-J-STD-001E OSHA training LEAN Manufacturing, JIT (Just In T

Boise Resume

Career Center | , | 2011-11-16 09:17:11.0

Mil standards 464, Mil Standards 2000, ESD Training, Cellular Manufacturing, TQM Totally Quality Manufacturing, ISO 9000 and 9001 IPC Standards, IPCA-610, IPC-J-STD-001E, OSHA training, LEAN Manufacturing, JIT (Just In Time) Six Sigma, AS400 Systems

Express Newsletter: heat stake process (910)

Partner Websites: heat stake process (3116)

Heat Staking Systems - Nordson DIMA

Nordson ASYMTEK | https://www.nordson.com/en/divisions/dima/processes/heat-staking-systems?con=t&page=4

. Heat is used to make it easier to create the stake. Heat control is critical, especially for glass filled plastics which often have a process window smaller than 10 degrees Celsius

Nordson ASYMTEK

Dispense Process Camera

GPD Global | https://www.gpd-global.com/co_website/features-camera.php

& Recorder FullView Illumination 2X Lens Extender High Depth of Field Lens - THERMAL - Pre-Heat Work Area Heat Post-Heat Thermal Imaging System Heated Body Pump Heated Syringe - OTHER - Real Time Process Control (FPC

GPD Global


heat stake process searches for Companies, Equipment, Machines, Suppliers & Information

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Non-heated dispensing system

Outstanding liquid dispensing and UV curing, all within one platform, watch the video.
IPC Training & Certification - Blackfox

Easily dispense fine pitch components with ±25µm positioning accuracy.


Best Reflow Oven
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