Heller 1936/2043 MARK 5 SMT REFLOW OVEN Heller Reflow Oven Heller SMT Reflow Oven Heller 1936/2043 MARK 5 SMT REFLOW OVEN Heller 1936/2043 MARK 5 Product description: Heller 1936/2043 MARK 5 SMT REFLOW OVEN INQUIRY Heller 193
Heller 1812 Air EXL Reflow Oven Reflow Oven SMT Reflow Oven Heller 1812 Air EXL Reflow Oven Heller 1812 Air EXL Product description: Heller 1812 Air EXL Reflow Oven INQUIRY Heller 1812 Air EXL Reflow Oven Products description
Heller Reflow Oven Model Number: 1700SX Serial Number: 0101DA-27810 Date: Jan 2001 6 Heating Zones 1 Cooling Zone Temperature: 300C Mesh Belt Conveyor Computer Controlled 208-240 Volts - 50/60 Hertz -3 Phase Dimensions: 11.2 x 4.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2018-12-11 19:12:27.0
Creating the next generation of digital Industry 4.0 technology standards, IPC will again take a major step forward at IPC APEX EXPO 2019, featuring two live production lines, at which visitors can see and experience achievements made in digital standards development over the past year.
Fuji CP6 manual Feeder calibration instrument Fuji CP6 manual Feeder calibration instrument HELLER Reflow Oven HELLER Reflow Oven, New And Used SMT Big Size Solder Oven, CNSMT HELLER 1809EXL HELLER 1809EXL, SMT 9Heat Zone Reflow Oven
NXTI NXTII NXTII M3 M6S XPF-L XP243 XP143 XP243 USED PICK AND PLACE MACHINE FOR SALE NXTI NXTII NXTII M3 M6S XPF-L XP243 XP143 XP243 USED PICK AND PLACE MACHINE FOR SALE UK DEK automatic printing machine ELA, HORIZON 01, HORIZON 02i, HORIZON 03i
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2015-01-05 17:38:26.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Career Center | Sullivan, Ohio USA | Engineering,Maintenance,Production,Quality Control,Technical Support
· Develop or upgrade preventative maintenance procedures for components, equipment, parts, or systems. · Quoting of jobs to be competitive with other companies. · Problem solving and communication with operators for quality assurance. Pro
Career Center | Sullivan, Ohio USA | Engineering,Maintenance,Production,Quality Control,Sales/Marketing,Technical Support
PROFESSIONAL EXPERIENCE Manufacturing Engineer August 1991 - January 2014 * Read blueprints, wiring diagrams, schematic drawings, or engineering instructions for assembling electronics units, applying knowledge of electronic theory and component
SMTnet Express, June 23, 2016, Subscribers: 25,290, Companies: 14,831, Users: 40,542 A Case Study on Evaluating Manual and Automated Heat Sink Assembly Using FEA and Testing Michael Sumalinog, Jesus Tan, Murad Kurwa; AEG, Flex (Flextronics
; BTU Pyramax 150 Reflow Oven; Conceptronic Reflow Ovens; Heller 1800 & 1900EXL Reflow Ovens; Quincy Ovens; Ekra Screen Printers; VI Technologies Vi3000