Electronics Forum | Fri Mar 20 15:10:54 EST 1998 | Steve Abrahamson
| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's
Electronics Forum | Sat Mar 21 16:37:22 EST 1998 | Earl Moon
| | Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | | 1. C
Used SMT Equipment | Soldering - Reflow
Features 1. Full hot air reflow heat fast, high thermal efficiency compensation, delta t less than ± 2 ℃ soldering is uniform. 2. HELLER company has 40 years of history, process maturity. 3. maintenance costs low, the furnace normal use, electrici
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Heller 公司 | https://hellerindustries.com.cn/bit_news/heller-industries-announces-joint-development-agreement-with-ibm-for-fluxless-mass-reflow-soldering-process-for-high-volume-manufacturing/
Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing - 电子邮件: jchen@hellerindustries.com.cn 电话: +86-21-64426180 公司 关于 新闻 事件 新设备 回流焊炉 双轨/双温度控制 固化和后端半导体 零空洞/真空炉 无助焊剂/酸性
| http://etasmt.com:9060/te_product_g/2020-08-06/15629.chtml
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