Electronics Forum | Wed Dec 21 11:33:22 EST 2022 | SMTA-64304420
Does anyone have experience with HiP defects with DDR memory components that they would be willing to share? I am interested in SMT process corrective actions and repair processes. I can discuss this privately if needed.
Electronics Forum | Wed Dec 28 16:49:26 EST 2022 | emeto
HiP most of the time goes back to the component package itself. If they are on the periphery of the part, it is a result excessive of expansion and contraction from the temperature. If it is in the middle, other contributors come in place.
Industry News | 2013-01-10 11:18:35.0
Datest, will highlight its testing, engineering, and training services in Booth #244 at the upcoming Medical Design & Manufacturing (MD&M) West Exposition, scheduled to take place February 12-14, 2013 at the Anaheim Convention Center in Anaheim, California.
Industry News | 2012-05-17 13:22:21.0
Datest,has successfully installed a XD7600NT500 Ruby X-ray Inspection System with X-Plane™ technology from Nordson DAGE.
SMTnet Express, May 26, 2016, Subscribers: 24,776, Companies: 14,803, Users: 40,361 Influence of Salt Residues on BGA Head on Pillow (Hip) J. Servin, P. Gomez, M. Dominguez, A. Aragon; Continental Corporation The oxide layers are known as wetting
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dages-peter-koch-to-discuss-failure-analysis-with-xray-at-epps-innovations-forum
. Koch will discuss failures on BGAs, HiP (Head-in-Pillow) defects, cracks and simple failures such as solder bridges. Most of these failures can be detected with 2D inspection
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& Place, 2009 Universal Genesis SMT Pick & Place, Agilent 5DX Series 5000 X-Ray, 2005 Vitronics 6748 Selective Soldering Machine, Conveyors and More
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