Electronics Forum | Fri Aug 24 12:20:41 EDT 2007 | petep
I have an MSL3 part (a relay) supplied in tape and reel. From what I am able to determine, these parts require baking at 257 degrees F for a minimum of 8 hours once the integrity of the seal is broken for over 168 hours. How are parts baked at th
Electronics Forum | Wed Oct 20 10:49:04 EDT 1999 | Brian
Hi! Stu's method is a half-truth. What it measures is the aggregate of all volatile material with a significant vapour pressure at the baking temperature, not just H2O. Short of very complex methods, it could be complemented by a comparitive measur
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2013-05-20 09:19:02.0
With the help of Schleuniger, Jabil, Inc. switched from hand tools to automatic crimping machines achieving labor and cost savings.
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. Circuit board preparation - masking, baking and other process steps. BGA site preparation. Solder mask breakdown - how to prevent it, how to fix it
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. How Moisture Absorption Damages Electronics One of the most troubling aspects of moisture-related damage to products is that it can be difficult to detect during the PCB assembly and testing process
