Electronics Forum | Thu Dec 26 12:12:55 EST 2013 | igorfo
Dear Friends, I need your help to understand requirements and measurement methods for bow and twist of assembled PCB (PCBA have and SMT and TH components). I already check all posts on the site but didn't found any related to my question answers.
Electronics Forum | Fri Jun 11 03:39:26 EDT 1999 | Gyver
| | | | Hello all! | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
the equipment side. A. Indium Corporation: Experimental In this experimental design, the key input (independent) variables are the solder alloy, reflow profile and number of reflows while the measured (dependent) variable is overall void percent. The
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FPC-with-Time-Pressure-Control-in-FLOware-Software-22240106.pdf
pressure readings (pg 23). If the problem is not resolved, perform the Test controller function (pg 23) procedure. Error messages The following chart defines the error messages that may display in the Error pane of the FPC/ TP Monitor (pg 27) window and how
