Industry Directory: hsp and head (1)

Span Manufacture Ltd

Industry Directory |

We are electronic contract manufacture and we also have JIT facility. Our head office located in Markham, Ontario, Canada. We do have a facility in USA, MEXICO and BRAZIL.

New SMT Equipment: hsp and head (82)

BGA Rework Machine for soldering and desoldering.  Hot Air BGA rework station for printed circuit board repair.

BGA Rework Machine for soldering and desoldering. Hot Air BGA rework station for printed circuit board repair.

New Equipment | Rework & Repair Equipment

BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla

Precision PCB Services, Inc

MK-878sv and (MK-880sv)

MK-878sv and (MK-880sv)

New Equipment |  

MINAMI�s line of screen printers, range from semi- over fully automatic in-line machines to sophisticated systems for the semiconductor industry. The printers demonstrate leading print accuracy and a repeatability of 2.0 Cpk at /-25 �m. Patented tec

MINAMI AMERICA INC.

Electronics Forum: hsp and head (181)

Universal HSP/GSM and Unicam

Electronics Forum | Mon Apr 17 16:22:29 EDT 2006 | jaimebc

Are there any users currently working with Unicam and Universal HSP and GSM? If so, what offline interface are you using? USOS or UCT-52. Was there any conflict between Universal's interface and Unicam? Thanks

Universal HSP/GSM and Unicam

Electronics Forum | Tue Apr 18 16:30:17 EDT 2006 | ratsalad

At my previous employer we ran HSP - GSM lines. Some sites used CIMBridge, others Unicam. We all used UCT52, not USOS, for the HSPs. At that time we had 4796's, 4791's, and USOS 4.X on our GSMs.

Used SMT Equipment: hsp and head (78)

Juki  KE-2070L Pick and Place Machine Specification

Juki KE-2070L Pick and Place Machine Specification

Used SMT Equipment | SMT Equipment

JUKI KE-2070L Pick and Place Machine Specification Model :KE-2070L ■ Laser mount head * 1 (6 suction nozzle) ■ PCB Board Size: L (50*30-410*360mm)   ■ Component height: 6mm ■ Component mount range:                 Laser Recognition:  0402(0100

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Mydata My9e Pick and Place

Mydata My9e Pick and Place

Used SMT Equipment | Pick and Place/Feeders

Make:  Mydata Model: My9e Vintage: 2009 Software Version:   TPSys 2.9 Details: • T3 Table • Hydra Head • Midas Head • Linescan • Dual Vision (DVS) Condition:  Complete & Operational Location

Lewis & Clark

Industry News: hsp and head (221)

Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

SMTnet

RSI's eSight Design for Manufacturability Solution Lowers PCB Manufacturing and Implementation Costs

Industry News | 2003-02-13 08:11:45.0

eSight Can Reduce Time-to-manufacture and Time-to-market by as Much as 80%

SMTnet

Parts & Supplies: hsp and head (259)

MPM Vacuum channel opening and closing cylinder

Parts & Supplies | Screen Printers

Name: P1928; vacuum channel opening and closing cylinder Part Number: P1928 Description: P1928 vacuum pump channel opening and closing cylinder Applicable models: UP; AP Printing Presses P1928 vacuum pump channel opening and closing cylinder C

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

MPM Vacuum channel opening and clo

Parts & Supplies | Screen Printers

Name: P1928; vacuum channel opening and closing cylinder Part Number: P1928 Description: P1928 vacuum pump channel opening and closing cylinder Applicable models: UP; AP Printing Presses P1928 vacuum pump channel opening and closing cylinde

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: hsp and head (6)

The Characterization and Comparison of Spray Fluxers

Technical Library | 1999-04-26 11:52:34.0

An evaluation of two fluxers, one with a reciprocating ultrasonic head and the other with microjets, was performed using nine independent criteria. The paper describes the methods of testing and the results.

Siemens Process Industries and Drives

Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect.

Technical Library | 2014-03-06 19:04:07.0

Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.

Christopher Associates Inc.

Videos: hsp and head (80)

Assembleon AX 201 pick and place head

Videos

BTW, we have sepcialzied in SMT field over 12 years and support one-stop SMT solution for our customers. Including SMT equipment and spare parts, such as Loader and Unloader, Reflow oven, Nozzle, feeder, motor, PCB board ect. We can also customize

Qinyi Electronics Co.,Ltd

Camalot NuJet and DDH (Dual Dynamic Head)

Camalot NuJet and DDH (Dual Dynamic Head)

Videos

NuJet and DDH

ITW EAE

Events Calendar: hsp and head (6)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Webinar: BGA and Area Array Process Defects - Causes & Cures

Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,

Webinar: BGA and Area Array Process Defects - Causes & Cures

Surface Mount Technology Association (SMTA)

Career Center - Jobs: hsp and head (1)

Failure Analysis and Debug (ICT) Technician

Career Center | Toronto, Ontario Canada | Engineering,Production,Quality Control

Work on ICT and functional test failures. Troubleshoot assemblies to the component level. Minimum one year of experience in Failure Analysis or In-Circuit Testing, or a recent graduate with a heavy course emphasis in this area. Understanding of

Adecco/Celestica

Career Center - Resumes: hsp and head (1)

Electronic Manufacturing (SMT),Technical Support Universal SMT Equipment

Career Center | , | Engineering,Maintenance,Management,Production,Technical Support

Having 10+years of Experience in manufacturing (SMT),Field Engineer Globally For Universal SMT Equipment .

Express Newsletter: hsp and head (164)

Partner Websites: hsp and head (60845)

UIC HSP 4790 & Sanyo TCM 3000

| https://pcbasupplies.com/smt-equipment-universal-instruments-uic-hsp-4790-sanyo-tcm-3000/

UIC HSP 4790 & Sanyo TCM 3000 Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick

FUJI FDU, HSP MICRO SWITCH S30874 | QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/s30874-fdu-hsp-micro-switch-202837?page=51&category=1115

Term:T/T, Paypal, Western Union... 3.Lead time: 2-4 Days    Products and service Surplus SMT Machines SMT Peripheral Equipments Products News Contact US   China Head Office   +86-075521635007  sales@qy-smt.com

Qinyi Electronics Co.,Ltd


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