Technical Library | 2013-05-30 17:33:26.0
This paper covers the following topics: The Measurement Application, Measurement Requirements, Measurement Problems, Measurement Results, Reference Samples, Conclusions
Technical Library | 2019-07-27 07:13:16.0
Carrier Tape refers to a strip product used in the field of electronic packaging, which has a specific thickness, and equidistantly distributes holes (also called pockets) for holding electronic components in the longitudinal direction thereof. Positioning hole for index positioning.
Technical Library | 2021-07-13 19:51:10.0
Flexible electronics refers to a class of lightweight, flexible and electronic sensing components and electronic devices built on stretchable substrates1 that are used (and can be used) for a broad set of products and applications such as displays and sensors. The most prominent characteristic is that they can bend in contrast to electronic systems built in rigid materials. They are manufactured on flexible plastic substrates, such as polyamide, PEEK2 or transparent conductive polyester films3, or other materials such as paper, textile, or thin glass. The term flexible also refers to the roll-to-roll manufacturing process.
European Commission - Executive Agency for Small and Medium-sized Enterprises (EASME)
Technical Library | 2017-09-14 01:21:52.0
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the shorter interconnect resulting from this effort has contributed to improving both electrical performance and functional capability. (...) This paper outlines both positive and negative aspects of current 3D package innovations and addresses the challenges facing adopters of silicon and glass based interposer fabrication. The material presented will also reference 3D packaging standards and recognize innovative technologies from a number of industry sources, roadmaps and market forecasts.
Technical Library | 2014-04-10 18:04:04.0
This paper is meant to be a guide and a reference to new and old members alike who wish to know about, understand, and improve on the decisions made and processes implemented to build the current solar panels. The following paragraphs in the introduction will lay out background information on solar panels and cube satellites. This entire document was written with the idea that the reader will be able to follow the decisions made to construct the solar panels and then with this knowledge find areas of the project for improvement.
Technical Library | 2021-12-22 01:35:51.0
As a speed type air compressor, centrifugal compressor can generate air flow moving in radial direction. Centrifugal air compressors are used by a large number of companies today because of their high-pressure tightness. Therefore, common faults in the operation have become one of the most concerned issues for users. This article will discuss causes of centrifugal compressor failures and give corresponding maintenance measures. At the end, OKmarts has listed the problems and solutions in detail for your quick reference.
Technical Library | 2020-11-15 21:22:11.0
The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with reference to nickel corrosion. The interpretation of the existing specification, that judges corrosion on 3 levels, is complex and if misinterpreted can lead to phantom failures. An obvious way to avoid any potential misinterpretation is to eradicate any evidence of corrosion completely.
Technical Library | 2017-04-20 13:51:14.0
The one constant in electronics manufacturing is change. Moore's Law, which successfully predicted a rate of change at which transistor counts doubled on Integrated Circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool. Increasing technical and economic requirements, deriving from the semiconductor environment, are cascaded down to the printed circuit and in particular to the IC substrate manufacturers. This is both a challenge and an opportunity for IC Substrate manufacturers, when dealing with the demands of the packaging market. (...)This paper introduces two new electroless copper baths developed for IC substrates manufacturing based on Semi Additive Process (SAP) technology (hereafter referred to as E'less Copper IC) and HDI production (hereafter referred to as E'less Copper HDI) and optimized for high throw into BMVs. An introduction to reliable throwing power measurement methods based on scanning electron microscope (SEM) is given, followed by a compilation and discussion of key performance criteria for each application, namely throwing power, copper adhesion on the substrate, dry film adhesion and reliability.
Technical Library | 2021-05-06 13:48:05.0
In this paper most commonly occurring Bare PCB defects such as Track Cut, Track short and Pad Damages are detected by Image processing techniques. Reference PCB without having any defects is compared with test PCB having defects to identify the defects and x-y coordinates of the center of the defects along with radii are obtained using Difference of Gaussian method and location of the individual type of defects are marked either by similar color or different colors. Result Analysis includes time taken for the inspection of a single defect, multiple similar defects, and multiple different defects. Time taken is ranging from 1.674 to 1.714 seconds if the individual type of defects are marked by different colors and 0.670 to 0.709 seconds if all the identified defects are marked by the same colors.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
