New Equipment | Tape and Reel Services
All standard pockets in stock means little to no lead time for our customers. Receive your finished reels correctly done and exactly when you want and need them. All applicable EIA taping standards are strictly enforced while in process and 100% fin
Illinois Components, Inc. Tape & Reel and I.C. Programming Services
MPCS is a leader in the manufacture of high-tech printed circuit boards. We provide lead times as fast as 2 days and have a standard lead time of 3 weeks.
Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN
I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f
Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Used SMT Equipment | Chipshooters / Chip Mounters
Model :KE-2070 pick and place machinePlacement speed:Chips:16, 000CPH(0.225sec/chip) Ics:4,600CPH(0.7sec/IC)Component mount range:0.4x0.2mm~□33.5mm Station:80Power supply:3P/200~415V/3KVASize:1,400x1, 393x1, 455mmWeight:1,530kg Current
Used SMT Equipment | Pick and Place/Feeders
Samsung Samsung CP45FV-Neo advantages: 1, simple operation, flexible line change: Samsung's CP and SM series Mounter is recognized by the industry's most simple operation of the model, which uses WinXP system, compatible with Gerb files,
Industry News | 2019-01-09 21:58:38.0
GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.
Industry News | 2013-09-16 13:58:19.0
Baja Bid has wrapped up another series of auctions, selling used SMT equipment in August to various bidders around the world.
Parts & Supplies | Pick and Place/Feeders
KE-2060 can place a wide range of components from 0603 and ICs, to odd-form, all at a high rate of speed. 12,500CPH?chip (laser centering/effective tact) 1,850CPH: IC (vision centering/effective tact), 3,400CPH with MNVC option. One multi-nozzle
Parts & Supplies | Pick and Place/Feeders
JUKI AF, AN electric feeder: AF24FS E5005706AB0, AF24FS-OP E5007706AB0 AF05HP E1001706AB0, AF081E E1002706AB0 AF081P E1004706AB0, AN081C E1009706AB0 AF16FS E4003706AB0, AF16NS E4004706AB0 AQ02HP 40042271, AF12FS E3003706AB0 JUKI FF electric fee
Technical Library | 2012-12-14 14:25:37.0
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device manufacturers have moved to satisfy market demands for more powerful products, smaller packaging, and longer battery life. By shrinking the size of the features they etch into semiconductor dice, IC manufacturers achieve lower costs, while improving speed and building in more functionality. However, this move toward smaller features has lead to lower breakdown voltages and increased opportunities for component overstress and false failures during in-circuit test.
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Cut and bend machine for taped axial components. axial component lead former be often used the axial resistance and diode. This is the motorized type former, you can use this axial lead f
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Cut and bend machine for taped axial components. axial component lead former be often used the axial resistance and diode. This is the motorized type former, you can use this axial lead f
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
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Leadership and Communication Training Series
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Leadership and Communication Training Series
Career Center | Manhattan, Kansas USA | Production
Ultra Electronics, ICE is a leader in small aircraft aerospace systems and components. ICE secured its first contract in the aircraft industry in 1975 by designing and manufacturing a state-of-the-art deicer timer for Cessna Aircraft Company. ICE c
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/agriculture-lawn-and-garden?page=11
. Full chemical compatible offering. Easy-to-operate electronic controls. Industrial Coating Systems Screens The use of quality screens from Nordson results in savings in your downstream process, including shortened lead times and decreased costs
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
+125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres