Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Manufacturer's Representative
Complete line of custom packaging materials and stock shipping supplies. Protective packaging, electronic component, ic tubes, anti static rubber bands, conductive corrugated boxes, bins, wafer packaging, foam, bags and boxes.
Industry Directory | Consultant / Service Provider / Manufacturer
We are a premier TAPE AND REEL service. We have extensive capabilities for your SMT and Through Hole components. Also I.C. PROGRAMMING including flash memory. First articles provided free of charge.
New Equipment | Board Handling - Storage
Solder paste printing range (1) SMT technology of resistance, capacitance, inductance, diode, triode and other chip components production and processing: 01005, 0201, 04020603, 0805, 1206 and other specifications and sizes; (2) , IC: support SOP, T
New Equipment | Assembly Services
Product features: The servo system is convenient and accurate for positioning. The Japanese THK guide rail and Taiwan STK variable frequency motor are used to drive the scraper base to ensure the printing accuracy. The printing scraper can be rota
Electronics Forum | Mon Jun 21 15:00:41 EDT 1999 | jgodfrey
I am finding that some of our IC's are coming from the supplier with the humidity gauge in the bag reading 10-20%. Has anybody done any tests to determine what humidty level in a package will cause problems during reflow?
Electronics Forum | Tue Sep 10 05:39:04 EDT 2019 | richgreen01
Hi all. I have put.an ic on the y wagon and done first.and last component. The machime picked up the part while testing the package but it didnt center the part ,just sat there for a while and failed. Any idea why this is and am I missing something?
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
.jpg)
Used SMT Equipment | Pick and Place/Feeders
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2003-05-30 08:09:11.0
A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.
Parts & Supplies | Pick and Place/Feeders
We also supply following Siemens Spare parts : 00375895-01 STOP STRIP RIGHT SIDE 2 00375987-01 STOP STRIP LEFT SIDE 2 00376006-01 Filter element f. air filter 00376038-01 CABLE: TREE SET POWER SUPPLY HS60 00376124S02 C-O-TABL
Parts & Supplies | Component Packaging
JUKI nozzle shaft/nozzle holder original new and used,copy new three choices all have quality guarantee JUKI nozzle shaft/nozzle holder JUKI 750 E30067250A0 Z SLIDER SHAFT ASM JUKI 2050 40001137 S HOUSING ASM JUKI 2050 40001140 BA
Technical Library | 2019-10-16 10:20:25.0
A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
ML-XC1000 Microfocus X-Ray Parts Counter This equipment is mainly used for the rapid counting of the reel type of material in SMT industry. Material types include all RC materials and IC materials. It is based on the high industrial 4.0 standard,
SMT is surface assembly technology, a new generation of electronic assembly technology developed from hybrid integrated circuit technology. SMT production line is also called surface assembly technology. Full-auto SMT Production Line is a new generat
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Taoyuan City,
SMTA Taiwan Tech Forum 2024
Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Career Center | San Jose/San Fran, California USA | Engineering
Our client, is a forerunner in high temperature semiconductor technology, seeks an Analog IC Design Engineer for their site in CA to work on product definition and designing Mixed Signal ICs. Established experience required in Analog & Mixed Signa
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
SMT Express, Volume 3, Issue No. 7 - from SMTnet.com Volume 3, Issue No. 7 Thursday, July 18, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: The Electronic Packaging
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2685&OB=ASC.html
". Why does the name change depending on the function of the part? By following this convention, if I have an IC and a transistor in identical SOFL packages, they would map to different footprints
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/wafer-x-ray-metrology/xm8000-wafer-x-ray-metrology-platform
, 2.5D and 3D IC packages, MEMS and wafer bumps. The XM8000 provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more
