Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Mon Feb 06 09:17:35 EST 2006 | Cal Kolokoy
Mike did you have these SEM'd to be able to see the IMC's within the solder joint?
Technical Library | 2012-09-20 21:45:38.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturin
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| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals
any other of your solder joints. Keep in mind, however; that the rosin flux residues may need to be cleaned off and this is where problems can develop
| http://etasmt.com/cc?ID=te_news_bulletin,13161&url=_print
(not just the solder ends) in contact with them are not thermally damaged, and that the formation of the IMC layer is not too thick
