New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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Electronics Forum | Mon Aug 18 20:46:08 EDT 2008 | davef
Volume of paste = 2X volume of the hole Questions are: * Why does your customer want the hole filled with solder? * Would materials other than solder be acceptable? * We assume 0.020" is drill size. What is the finished size of the hole? * What is t
Electronics Forum | Fri Jun 25 11:05:19 EDT 1999 | Christopher Cross
| hello, | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | thanks for the input | | wayne | | | We have tried this mainly on thru hole connectors (.035 pins, .1 s
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Parts & Supplies | Assembly Accessories
Brand Model Specification Material of nozzle tip YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Tungsten steel YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Diamond steel YAMAHA YV100II 32#NOZZLE For IC of tiny size Tungsten steel YAMAHA YV100
Parts & Supplies | Assembly Accessories
YAMAHA Nozzle in stock YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) YAMAHA YV100II 32#NOZZLE For IC of tiny size YAMAHA YV100II 39#NOZZLE 0603 "O" hole YAMAHA YV100II 33#NOZZLE For IC YAMAHA YV100II 34#NOZZLE For IC YAMAHA YV100II 35#NOZZLE
Technical Library | 2020-07-15 18:49:03.0
Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
The following video guides the user through a typical data collection process. These steps may vary depending on the process your company uses. Categories: WaveRIDER, WaveRIDER SPC (v5.2x)
>>CONTACT MAC NOW Email: at@mooreplc.com Mobile: +8618020714662(WhatsApp) Skype: +8618020714662 >>>CONTACT MAC NOW ✦ Quick Details ✦ DS200CTBAG1ADD GE Mark V Terminal BoardThe DS200CTBAG1ADD is a terminal board designed for use with
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
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Lewis & Clark | http://www.lewis-clark.com/product-tag/thru-hole/
Thru Hole Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis
