New SMT Equipment: indium 3.2 solder ball (2)

Flux and Epoxy Products

Flux and Epoxy Products

New Equipment | Solder Materials

Indium Corporation is a developer, manufacturer, and global supplier of: specialty solders (including solder paste, preforms, spheres, columns, wire, tubing, ribbon, and foil), fluxes, electrically-conductive adhesives, inorganic compounds (including

Indium Corporation

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

Electronics Forum: indium 3.2 solder ball (39)

Solder ball specifications?

Electronics Forum | Tue Jan 29 15:48:31 EST 2002 | davef

On his site "SMT In Focus", our friend Brian Sloth Blitzen lists the following sampling of lead-free [no lead] links: * Alpha Metals: http://www.alphametals.com/lead_free/index.html * Circuits Assembly magazine: http://www.circuitsassembly.com/db_ar

ive solder profiles

Electronics Forum | Mon Aug 04 14:17:18 EDT 2008 | grics

Patrick, you are right. I am sorry. It is a Water based flux. (We have another no clean flux indium 3592 that is used in our leaded process. It is alcohol based and had their base confused) Chunks, yes, this has always been a problem. If ther

Industry News: indium 3.2 solder ball (33)

Two Indium Corporation Experts to Present “Best Papers” at SMTA South China Technology Conference 2018

Industry News | 2018-08-16 20:05:44.0

Indium Corporation Research Chemist, Mary Ma, and Area Technical Manager for Eastern China, Wisdom Qu, will present their papers at the 2018 SMTA China South Technology Conference on Aug. 28 in Shenzhen, China.  Their papers were voted by their peers as two of the top five “Best Papers” presented in recent years at SMTA South China and SMTA East China, earning them the opportunity to present them again at this year's show.

Surface Mount Technology Association (SMTA)

IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS

Industry News | 2011-08-18 21:23:09.0

For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: indium 3.2 solder ball (2)

Samsung J90650160C Feeder Cylinder For Samsung SM8mm Feeder 8mm CJ2R10-8.3B-KRJ

Samsung J90650160C Feeder Cylinder For Samsung SM8mm Feeder 8mm CJ2R10-8.3B-KRJ

Parts & Supplies | Assembly Accessories

Detailed Product Description Brand: SMC Part Name: Cylinder Part Number: J90650160C Model: CJ2R10-8.3B-KRJ Origin: China Condition: Original New J90650160C Feeder Cylinder For Samsung SM8mm Feeder 8mm feeder cylinder Deatail Information: 1,

KingFei SMT Tech

Sony 索尼Mx200 / Mx200L SMT配件,SONY SM

Sony 索尼Mx200 / Mx200L SMT配件,SONY SM

Parts & Supplies | Solder Paste Mixers

12  2-693-981-01  ..... -.... (UNST6-30) BOLT (UNST6-30), STOPPER  4  UNST6-30     13  2-693-982-01  ........ -..- MAKC1008A ABSORBER (MAKC1008A), SHOCK  4  MAKC1008A     14  2-693-982-11  ........ -..- MAKC1008B ABSORBER (MAKC1008B), SHOCK  4  MAK

SMTSKY ASIA LIMITED

Videos: indium 3.2 solder ball (1)

NF120(200 nano resolution) X-ray Inspection System

NF120(200 nano resolution) X-ray Inspection System

Videos

#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application

SEC

Express Newsletter: indium 3.2 solder ball (982)

SMT Express, Volume 2, Issue No. 5 - from SMTnet.com

Featured Article Return to Front Page Soldering Technolo

SMTnet Express June 6 - 2013, Subscribers: 26122

SMTnet Express June 6, 2013, Subscribers: 26122, Members: Companies: 13388, Users: 34775 Best Practices Reflow Profiling for Lead-Free SMT Assembly by: d Briggs and Ronald C. Lasky, Ph.D., PE; Indium Corporation of America The combination

Partner Websites: indium 3.2 solder ball (16)

Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296

containing various combinations of solid solution and dispersion strengthening agents. Daisy chained ball grid array (BGA) test vehicles were fabricated with SAC305 as a baseline and three different developmental alloys each employing significant additions of various combinations of antimony (Sb), indium (In), and bismuth (Bi

Surface Mount Technology Association (SMTA)

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

/125 °C profiles. The key findings from the thermal cycling tests and subsequent failure analysis are as follows: ▪ X-ray and metallographic inspections showed that the solder paste was effective at producing extreme voiding in many of the ball locations

Heller 公司


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