New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Electronics Forum | Tue Apr 05 15:06:51 EDT 2011 | remullis
I am currently running at 2.12 minutes TAL using Indium 8.9HF. I am up to 68/cm min in a 8 zone oven. Indium recommends 30-100 sec or .30 to 1.40 minutes, I am think of increasing the conveyor speed until I fall with the 1.40 minutes, does anyone hav
Electronics Forum | Thu Apr 07 10:36:45 EDT 2011 | markhoch
It's all relative to your Zone Temps and the thermal profile of your assembly. Without knowing what they are, we'd be irresponsible to offer any advice on adjusting your conveyor speed.
Industry News | 2010-08-04 21:14:00.0
Indium8.9HF-1 Solder Paste is a no-clean Pb-free halogen-free solder paste that offers the best-in-class probe-testability and unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Industry News | 2015-10-27 22:08:05.0
Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.
