Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Nano-copper sintering in formic acid vapor.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000. SimpleCoat basic model without tilt and rotate
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
http://www.gpd-global.com Conformal coating (SimpleCoat) demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system. The Spray Valve sprays HumiSeal 1B31 from a height of approximately 20 mm above the board. The Volumetr
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
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