Industry Directory | Manufacturer
Manufacturers flexible printed circuits, circuit materials, IC packaging substrates, laminates, conductive coatings and tapes
Industry Directory | Manufacturer
1-20 layers PCB manufacturer, focusing on metal core pcb, multi-layer PCB, fast PCB and middle-small batch PCB. Min. circuit width & spacing: 3mil. UL, ISO9001, ROHS,ISO14001 certified.
To shield against emissions, there must be a barrier of an electrical conductive material. Shielding laminates provide an economical and effective solution to this problem. Most of our materials consist of a metal foil (usually, copper or aluminum)
Product Description Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating mo
Electronics Forum | Tue Jan 29 20:14:54 EST 2002 | davef
Please help us understand your situation better by describing the following: * Component [ie, PTH/SMT, type of component, lead finish you expected/ received, etc.] * Board type [ie, type of board FR-4/CEM/ceramic, etc.] * Solderability protection on
Electronics Forum | Mon Apr 29 05:28:55 EDT 2002 | ianchan
Hi, does that rosy cheeked sales vendor of yours, have a website I can review? do they have online info of that IMPCB? if not, any email contact I can inquiry with? just curious on that IMPCB... Thanks.
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2012-10-05 16:44:21.0
y IPC — Association Connecting Electronics Industries®. Published annually, the report offers consensus estimates of PCB production value by country and by product category, and analysis of global and regional PCB industry trends
Technical Library | 2023-07-04 17:31:22.0
Conformal Coatings are polymeric materials used to protect circuitry, parts, and related components. They are most commonly used to protect printed circuit boards (PCBs) and electronic devices. However, conformal coatings can be applied to a wide variety of materials, including metal, plastic, silicone, ceramics, glass, and even paper. We use the term "substrate" to refer to an object or material that's been coated with a conformal coating.
Technical Library | 2020-09-02 22:14:36.0
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control. The SAP process using sputtered copper is a solution, but the sputtering process is expensive and has issues with via plating. SAP using electroless copper deposition is another solution, but the process involved is challenged to achieve adequate adhesion and insulation between fine-pitch circuitries. A novel catalyst system--liquid metal ink (LMI)--has been developed that avoids these concerns and promotes a very controlled copper thickness over the substrate, targeting next generation high density interconnect (HDI) to wafer-level packaging substrates and enabling 5-micron level feature sizes. This novel catalyst has a unique feature, high density, and atomic-level deposition. Whereas conventional tin-palladium catalyst systems provide sporadic coverage over the substrate surface, the deposited catalyst covers the entire substrate surface. As a result, the catalyst enables improved uniformity of the copper deposition starting from the initial stage while providing higher adhesion and higher insulation resistance compared to the traditional catalysts used in SAP processes. This article discusses this new catalyst process, which both proposes a typical SAP process using the new catalyst and demonstrates the reliability improvements through a comparison between a new SAP PCB process and a conventional SAP PCB process.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
For more information visit: http://www.lpkfusa.com/pls/ The LPKF ProtoLaser S is a fully enclosed laser system for PCB prototyping and production on-demand. It combines advanced laser technology, optics, and x/y table mechanisms that result in high
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
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SMTnet Express, October 15, 2015, Subscribers: 23,684, Members: Companies: 14,684, Users: 39,145 Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication Dave Sommervold, Chris Parker, Steve
Surface Insulation Resistance Testing. Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Solder Paste Reattachment If you don't see the images, please visit online version at #Application
ASCEN Technology | https://www.ascen.ltd/Products/PCB_depaneling_machine/160.html
> PCB handling machine > PCB depaneling machine > > Show all PCBs cutting machine Model: ASC-620 Brand: ASCEN Delivery Time: 7 days Desciption: This PCB cutting machine that can use for aluminum substrate,FR4,CEM-1,MCPCB multiple type material ,it can suitable for cutting maximum 4mm thickness PCB panel without the bend and twist with high
| https://www.eptac.com/3d-electronics-as-an-alternative-to-printed-circuit-boards-pcbs/
. This reduces the manufacturing complexity, lowering weight and enabling new form factors since rigid PCBs are no longer required. The basic principle for in-mold electronics is that a circuit is printed onto a thermoformable substrate which is then molded to its desired shape and filled with injection-molded plastic
