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. It's an exciting time for the micro-electronics industry as device density continues to increase, which brings new challenges for interconnect evaluation
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presence of micro cracks and surface defects such as scratches and chips. In these materials, the high level of stress at the tip of a crack cannot be relieved by plastic flow and so even very small defects can lead to low failure loads
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+ (Advanced Certified Interconnect Designer) is the ultimate professional industry certification for a designer looking to obtain what we would consider the highest possible PCB Design status in the industry
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Contact Global HQ Africa Asia Central and South America Europe USA and Canada First Bond Ball/Stud Bump Pull Copper is increasingly replacing gold as the interconnect material for wire bonds, stud
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. It's an exciting time for the micro-electronics industry as device density continues to increase, which brings new challenges for interconnect evaluation
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Nozzles Real Time Process Control (FPC) Lead Formers Lead Formers Selection Axial Lead Former Radial Lead Former Peel Force Tester Peel Back Force Tester Applications APPLICATIONS OVERVIEW Conductive Adhesive Non-Conductive Adhesive Dam