Industry Directory: interconnections (118)

Association Connecting Electronics Industries (IPC)

Association Connecting Electronics Industries (IPC)

Industry Directory | Association / Non-Profit / Events Organizer / Training Provider

IPC is the trade association for the printed wiring board and electronics assembly industries.

Interconnecting Technologies

Industry Directory | Consultant / Service Provider / Manufacturer

PCB designing, PCB Manufacturing ,Reverse Engineering, Product Designing, Product Manufacturing ,Speed delivery of sample PCB

New SMT Equipment: interconnections (131)

HDI PCB, High density PCB, High density interconnect PCB, HDI PCB Manufacturing -- Hitechpcba

HDI PCB, High density PCB, High density interconnect PCB, HDI PCB Manufacturing -- Hitechpcba

New Equipment | Fabrication Services

HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri

Hitech Circuits Co., Limited

Component Identification Training

Component Identification Training

New Equipment | Education/Training

Learn to identify (with the use of aids, visuals or actual components) packaging types of the most commonly used through-hole and surface mount components, interconnections and hardware used in electronic assembly. This course also covers color code

EPTAC Corporation

Electronics Forum: interconnections (153)

Panel/Pallet Separating with Interconnects

Electronics Forum | Fri Jul 19 13:33:25 EDT 2002 | gdstanton

Dave, fyi...we decided not to go with the interconnects. At least during development phase due to excessive NRE to support the effort. However, we may revisit this when we come to production phase. Gregster

MID ( Molded Interconnect Device ) Mount

Electronics Forum | Sun Nov 24 22:09:13 EST 2019 | fadzril

Does anyone have experience of mounting MID ( molded interconnect device )? What items are required to be prepared? Can I use my current printer, mounter or reflow ovens?

Used SMT Equipment: interconnections (36)

FocalSpot FSX-075eh

FocalSpot FSX-075eh

Used SMT Equipment | X-Ray Inspection

220X magnification provides excellent viewing of the smallest SMD electrical interconnections.  Easy-to-use  >220X magnification  Excellent imaging quality  Flexible board/part handling  Multipurpose inspection tool  Portable, small 32”x

Precision PCB Services, Inc

Electrovert Aquastorm 200

Electrovert Aquastorm 200

Used SMT Equipment | Board Cleaners

Angle Adjust Input Conveyor   Hurricane Jet Performance Package   Convenience Package   Gas Heat Option Includes (heater, transfer pump, and interconnect)   Resys ARS212 Recycle System   Upgraded Pumps and Blowers Auc

X-Line Asset Management

Industry News: interconnections (1029)

GPD Global to Debut New Technology for Fine Line and Nano Shot Dispensing at SEMICON West 2013

Industry News | 2013-06-10 17:08:51.0

GPD Global will exhibit in Stand #6275 in the North Hall at the 2013 SEMICON West exhibition & conference. Representatives from GPD Global will exhibit the company's new technology related to fine line and nano-shot dispensing, particularly related to vertical interconnect technology.

GPD Global

Parts & Supplies: interconnections (9)

Assembleon Interconnection Board

Assembleon Interconnection Board

Parts & Supplies | Pick and Place/Feeders

5322 320 11235    HARNESS 2-4 (Y-FLEX)    2,277.99 Service Parts - New        5322 320 11239    HARNESS 3-2 (Z-ORG)    1,228.91 Service Parts - New        5322 320 11244    HARNESS 2-10    751.76 Service Parts - New        5322 320 11374    HARNES

Qinyi Electronics Co.,Ltd

Assembleon ASSEMBLEON - PCB Interconnection Board .9498 396 01670

Assembleon ASSEMBLEON - PCB Interconnection Board .9498 396 01670

Parts & Supplies | Pick and Place/Feeders

5322 290 60799    AIR SUPPLY COUPLING    265.89 Service Parts - New        5322 290 60838    SET-UP AUX CONTACT    340.96 Service Parts - New        5322 290 81508    CONTACT ELEMENT    105.27 Service Parts - New        5322 310 10689    FILTER, B

Qinyi Electronics Co.,Ltd

Technical Library: interconnections (82)

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Technical Library | 2023-01-17 17:58:36.0

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.

Heller Industries Inc.

Small Volume Solder Paste Dispensing for Aerospace and Defense

Technical Library | 2023-09-07 14:38:31.0

A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.

GPD Global

Videos: interconnections (90)

Electronics in Harsh Environments Conference 2019 Summary

Electronics in Harsh Environments Conference 2019 Summary

Videos

Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh

Surface Mount Technology Association (SMTA)

Sharon Starr Discuss IPC Market Research Opportunities

Sharon Starr Discuss IPC Market Research Opportunities

Videos

The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex

Association Connecting Electronics Industries (IPC)

Training Courses: interconnections (99)

IPC J-STD-001 Trainer (CIT) Certification Training Course

Training Courses | | | IPC J-STD-001 Trainer (CIT)

The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.

Blackfox Training Institute, LLC

IPC J-STD-001 Trainer (CIT) Recertification Course

Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.

The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: interconnections (27)

Ultra High Density Interconnect Conference

Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Peoria,

Ultra High Density Interconnect Conference

Surface Mount Technology Association (SMTA)

Post – Moore's Law Electronics: From Now until Quantum Computing

Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,

Post – Moore's Law Electronics: From Now until Quantum Computing

Surface Mount Technology Association (SMTA)

Career Center - Jobs: interconnections (11)

Web Content Producer

Career Center | Cleveland, Ohio | Management,Production,Sales/Marketing

Responsible for the creation and production of web content for electronics interconnect industry-based web site. Coordinates the production of content from concept to broadcast. Writes and edits site content. Technically produces and directs live,

Solder.com

Sales Representative

Career Center | Independence, Ohio USA | Sales/Marketing

Solder.com is a new B2B exchange for the electronics interconnect and assembly industry. We are looking for an experienced sales representative to sell memberships and associated services to suppliers in the electronics manufacturing industry. This

Solder.com

Career Center - Resumes: interconnections (9)

Bob Riemer's resume

Career Center | Danville, California | Sales/Marketing

Robert Riemer 129 Wilshire Ct. Danville, CA. 94526 (925) 820-6545 Home (925) 820-6546 Fax (925) 548-9633 Cell briemer@pacbell.net OBJECTIVE Seeking a challenging sales position with a dynamic company pursuing rapid, consistent growth in the electro

Jerry McBeth Resume

Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development

Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting

Express Newsletter: interconnections (847)

Partner Websites: interconnections (104)

3D Packaging & Wafer-Level Packaging | Nordson ASYMTEK

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/3d-packaging-and-wafer-level-packaging

& Wafer-Level Packaging Dispensing applications for stacked dies with through silicon vias (TSV) and face-to-face stacked dies 3D packages are emerging in the semiconductor packaging industry to address the serious technical challenges such as miniaturization, faster interconnections, power

ASYMTEK Products | Nordson Electronics Solutions

SolderTip #41: J-STD-001 Revision E is Here - Order it Now! - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertip-41-j-std-001-revision-e-is-here-order-it-now/

. This revision includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and verification for producing quality soldered interconnections and assemblies


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PCB Handling Machine with CE

Training online, at your facility, or at one of our worldwide training centers"
High Throughput Reflow Oven

Reflow Soldering 101 Training Course
Sell Your Used SMT & Test Equipment

Stencil Printing 101 Training Course
design with ease with Win Source obselete parts and supplies

Private label coffee for your company - your logo & message on each bag!