IPC is the trade association for the printed wiring board and electronics assembly industries.
Learn to identify (with the use of aids, visuals or actual components) packaging types of the most commonly used through-hole and surface mount components, interconnections and hardware used in electronic assembly. This course also covers color code
Continuing the educational series for PCB Design, the IPC Advanced Designer Certification or CID+ (Advanced Certified Interconnect Designer) is the ultimate professional industry certification for a designer looking to obtain what we would consider t
Electronics Forum | Fri Jul 19 13:33:25 EDT 2002 | gdstanton
Dave, fyi...we decided not to go with the interconnects. At least during development phase due to excessive NRE to support the effort. However, we may revisit this when we come to production phase. Gregster
220X magnification provides excellent viewing of the smallest SMD electrical interconnections. Easy-to-use >220X magnification Excellent imaging quality Flexible board/part handling Multipurpose inspection tool Portable, small 32”x
Industry News | 2013-06-10 17:08:51.0
GPD Global will exhibit in Stand #6275 in the North Hall at the 2013 SEMICON West exhibition & conference. Representatives from GPD Global will exhibit the company’s new technology related to fine line and nano-shot dispensing, particularly related to vertical interconnect technology.
Industry News | 2003-06-26 08:12:04.0
He replaces Robert J. Schutz
VG Mass Interconnect is a series of modular fixture products that allows quick connection between the UUT (unit under test) and a custom test system. VG mass interconnect is divided into 2 segments: Receivers (Tester Side), and Fixture Kits (DUT
VG Mass Interconnect products provide a common Universal interface for your custom test rack and simplifies functional test across your product line. Mass interconnect bench-top and rack mount receiver Plug and play interface blocks for signal, co
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.
The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.
Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Career Center | Cleveland, Ohio | Management,Production,Sales/Marketing
Responsible for the creation and production of web content for electronics interconnect industry-based web site. Coordinates the production of content from concept to broadcast. Writes and edits site content. Technically produces and directs live,
Career Center | Independence, Ohio USA | Sales/Marketing
Solder.com is a new B2B exchange for the electronics interconnect and assembly industry. We are looking for an experienced sales representative to sell memberships and associated services to suppliers in the electronics manufacturing industry. This
Career Center | Danville, California | Sales/Marketing
Robert Riemer 129 Wilshire Ct. Danville, CA. 94526 (925) 820-6545 Home (925) 820-6546 Fax (925) 548-9633 Cell email@example.com OBJECTIVE Seeking a challenging sales position with a dynamic company pursuing rapid, consistent growth in the electro
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
passivation layers is difficult. This is due to the nature of the protective coating which is well-adhered to the surface. Further complications arise from the interconnects
ACI Technologies, Inc Automated Testing with Boundary Scan Boundary scan is a method for testing interconnects on printed circuit boards (PCBs