| https://www.eptac.com/webinar/how-to-create-the-perfect-solder-joint/
. Topics we will be reviewing are: The definition of intermetallic compounds. How they occur in the soldering/manufacturing process. Critical characteristics and how they change over time
| http://etasmt.com/te_news_industry/2021-09-01/24162.chtml
-3.5um intermetallic compounds in soldering, intermetallic compound formation temperature is above the melting point of 10-15, the lead soldering is 195-200
| http://etasmt.com:9060/te_news_industry/2021-09-01/24162.chtml
-3.5um intermetallic compounds in soldering, intermetallic compound formation temperature is above the melting point of 10-15, the lead soldering is 195-200
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4722
. Because of the small volume of solder employed, intermetallic compounds comprise a significant fraction of the resulting solder joint, and very fine Ag3Sn precipitate morphologies can occur
| https://www.eptac.com/webinars/how-to-create-the-perfect-solder-joint/
. Topics we will be reviewing are: The definition of intermetallic compounds. How they occur in the soldering/manufacturing process. Critical characteristics and how they change over time
| https://www.eptac.com/webinars/how-to-create-the-perfect-solder-joint
. Topics we will be reviewing are: The definition of intermetallic compounds. How they occur in the soldering/manufacturing process. Critical characteristics and how they change over time
| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
. One example of how the interactions between solder and surface finish can affect solder joint integrity is the potential formation of brittle gold/tin intermetallic compounds (IMCs
| https://ipcapexexpo.org/ipc-apex-expo-2021-professional-development-courses
| H-Technologies Group PD11: Reliability of Electronics - Role of Intermetallic Compounds Jennie Hwang | H-technologies Group PD27: Measurement System Analysis For Electronics Assemblies - Part I Jose Servin
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