Industry News: intermetallic compounds (Page 1 of 5)

Best Papers from SMTA International Announced

Industry News | 2024-02-05 14:05:05.0

The SMTA is pleased to announce the Best Papers from SMTA International 2023. The winners were selected by members of the conference technical committee. This year awards were given for the "Best of Proceedings" category but also for a new designation of "Best Practical and Applications-Based Knowledge." A plaque is given to primary authors of all winning papers for these exceptional achievements.

Surface Mount Technology Association (SMTA)

Metcal Introduces the Next Big Step in Process Control: Connection Validation™

Industry News | 2017-02-13 13:22:05.0

Metcal’s CV-5200 Connection Validation™ Soldering Station provides real-time closed loop feedback on intermetallic compound formation— the world’s first. Plus, a new communication port enables process traceability and firmware upgrades.

Metcal

Metcal introduces the new CV-500 Connection Validation™ Soldering System

Industry News | 2018-10-11 19:50:17.0

Metcal is pleased to introduce the new CV-500 Connection Validation™ Soldering System, the companion station to the CV-5210 CV Soldering System. The CV-500 packs all of the Connection Validation technology into a compact, economical housing.

Metcal

Nihon Superior Premiers SN100C High-Reliability Lead-Free Solder Spheres

Industry News | 2009-01-23 17:20:22.0

OSAKA, JAPAN � January 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, introduces SN100C high-reliability lead-free solder spheres.

Nihon Superior Co., Ltd.

Nihon Superior's Keith Sweatman to Present at TMS Annual Conference

Industry News | 2012-02-15 19:03:23.0

Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present “The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solders” at the upcoming TMS Annual Conference. The presentation will take place during the session, titled “Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies: Solder Alloy Design for Challenging Applications”.

Nihon Superior Co., Ltd.

Nihon Superior’s Keith Sweatman to Introduce Novel Lead-Free Alloy for Elevated Temperature Service at SMTA International

Industry News | 2013-09-17 15:25:45.0

Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present at SMTA International, which is scheduled to take place October 12-17 at the Fort Worth Convention Center in Texas.

Nihon Superior Co., Ltd.

Metcal Wins Its Fifth Award for Connection Validation

Industry News | 2017-11-15 20:16:33.0

Metcal announces that it was awarded a 2017 Global Technology Award in the category of Hand Soldering for its CV-5200 Soldering and Rework Systems with Connection Validation technology. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. This marks the company’s fifth award since its introduction at the beginning of 2017.

Metcal

Indium Corporation Technology Expert Presents Professional Development Course at ECTC 2011

Industry News | 2011-05-19 17:07:57.0

Indium Corporation's Vice President of Technology Dr. Ning-Cheng Lee will teach a professional development course at the Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Florida, May 31-June 3, 2011.

Indium Corporation

SMT reflow oven process principle and introduction

Industry News | 2018-10-18 09:42:39.0

SMT reflow oven process principle and introduction

Flason Electronic Co.,limited

Nihon Superior to Discuss Intermetallic Stability at the Pan Pacific Microelectronics Symposium

Industry News | 2012-01-13 12:42:50.0

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Senior Technical Advisor Keith Sweatman will present “The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints” at the SMTA Pan Pacific Microelectronics Symposium.

Nihon Superior Co., Ltd.

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