Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and
New Equipment | Test Equipment
PROCESS SCIENCES, INC. (PSI) Visit our main Ion Chromatography page for more information. Ion Chromatography analysis (IC) is an essential tool for both failure analysis and process validation. PSI uses IC to investigate surface contamination and m
Electronics Forum | Wed Nov 03 21:17:40 EST 1999 | Doug B.
Yes this is absolutely true. No-clean flux residue has various affects on the functionality of circuitry especially high impedance circuits. It also affects solderability, and reliability. No-clean flux will always leave a detectable residue. Mos
Electronics Forum | Sun May 24 06:02:33 EDT 1998 | Earl Moon
| Hello, | I am looking for suggestions for cleaning pcb's after the routing (fabrication) process. Keep in mind that these pcb do not have components intalled on them yet. | We have considered pre-drilling the routing plunge points, but cost and ca
Industry News | 2001-01-23 10:52:31.0
IPC has honored 27 members at IPC SMEMA Council's Electronic Assembly Process Exhibition and Conference (APEXSM) in San Diego, CA for their contributions to IPC and the electronics industry.
Industry News | 2022-10-12 11:23:36.0
In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner, PCBA cleaner, Wave Oven Pallet/Fixture cleaner, Mis-Print PCB cleaner, Squeegee cleaner, Nozzle cleaner, PCB surface cleaner and so on.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
SMTnet Express, April 29, 2021, Subscribers: 27,195, Companies: 11,344, Users: 26,617 Failure Analysis – Using Ion Chromatography And Ion Chromatography/Mass Spec (IC/MS) Since the 1980s the electronics industry has utilized ion
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
. The cleaning room contains two layers of cleaning baskets, which can clean more boards at one time. Thoroughly and effectively clean organic and inorganic pollutants such as rosin, no-clean flux, water-soluble flux and other organic and inorganic pollutants on the surface of SMT/THT PCBA after soldering
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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