Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification / Training Provider
Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry.
New Equipment | Rework & Repair Equipment
Visit PSI's main Coplanarity Services page for more information. PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles. The goal of lead restoration is not to mimic "l
New Equipment | Soldering - Other
Vacuum Soldering Oven Machines KD-V20 Application : 1 IGBT module 2 MEMS 3 Large power modules package 4 Optoelectronic package 5 Hermetic Seals Feature : 1. Viewing system: Cavity with a visual window, can observe
Electronics Forum | Mon Jul 29 09:27:15 EDT 2013 | charliedci
All of our reflow is with room air, 63/37 and SAC305. I believe nitrogen will get you better looking solder joints (shiny, less grainy under magnification), but per IPC, functionality and strength I don't think there is much difference.
Electronics Forum | Tue Oct 26 15:44:35 EDT 2004 | Paul_pmd
Hi Mike, Surface mount components arn't difficult to work with at all. They have pretty much the same tolorance to heat degridation as Dip packages. I suggest two Irons when working with two pole resistors and caps. Heating only one end at a time wil
Industry News | 2016-10-09 20:43:23.0
The SMTA Capital Chapter is pleased to announce its final meeting of 2016 will be on November 10th, from 5:00 pm to 7:00 pm at Zentech, 6980 Tudsbury Road, Baltimore, Maryland 21244. The focus of this chapter meeting will be “AXI and MXI; How They Complement Each Other” presented by John Travis, Nordson Dage.
Industry News | 2015-01-20 16:20:16.0
FSInspection, a division of Freedom Scientific, will highlight its high-magnification, visual inspection stations in Booth #3720 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Designed for today’s industrial markets, the series includes the HDMag® High-Magnification Visual Inspection Station, X-Mag™ Machine Vision Station and PKMag® 50 Portable Visual Inspection Device.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Tue Dec 11 00:00:00 EST 2018 - Tue Dec 11 00:00:00 EST 2018 | ,
Inspecting PWB Assemblies for Defects
Career Center | Irvine, California USA | Quality Control
In Process Testing / QA Inspector In-circuit testing of SMD type assemblies Functionally test SMD type assemblies Visually inspect SMD type assemblies Load and unload (burn-in, etc.) Must be physically fit, able to lift up to 10 pounds Must have goo
Career Center | Irvine, California USA | Production
SMT Soldering/Solder Touch-Up/Rework Inspect and touch-up SMD type assemblies Read and implement rework instructions Identify and pull parts from stock for rework Perform visual inspection Manually place component onto PCBs on automated assembly line
SMTnet Express, January 28, 2016, Subscribers: 24,061, Members: Companies: 14,944, Users: 39,825 Meet the Forward Thinkers of Today at IPC APEX EXPO 2016 Free Networking Events Las Vegas Convention Center. Conference & Exhibition: March 15
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/jade-plus
. Ensure IPC-A-610 and IPC-7095 compliance with built in checking for BGA and QFN voiding, solder ball diameter, roundness, bridge and missing
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100