Partner Websites: ipc-4101/99 (Page 1 of 13)

IPC Standards for Manufacturing & Assembly - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html

: 20 Jul 2012 Location: Hollister, CA Status: Offline Points: 83 Post Options Post Reply Quote rdl86626 Report Post    Thanks(1)    Quote    Reply Posted: 08 Mar 2013 at 8:35am Hi,   We use IPC-A-600, IPC-4101, IPC- 6011, IPC-6012, IPC-6013, IPC-SM-840 FOR FABS Assembly's only IPCF-STD-001

PCB Libraries, Inc.

IPC Standards for Manufacturing & Assembly - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html

: 20 Jul 2012 Location: Hollister, CA Status: Offline Points: 83 Post Options Post Reply Quote rdl86626 Report Post    Thanks(1)    Quote    Reply Posted: 08 Mar 2013 at 8:35am Hi,   We use IPC-A-600, IPC-4101, IPC- 6011, IPC-6012, IPC-6013, IPC-SM-840 FOR FABS Assembly's only IPCF-STD-001

PCB Libraries, Inc.

IPC Standards for Manufacturing & Assembly - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic877&OB=ASC.html

specified IPC standards on here? Any and all thoughts are welcome! I will start this, Currently we only specify the following:- IPC-A-600 - Acceptability of Printed Boards IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-4103 - Specification for Base Materials for High Speed / High

PCB Libraries, Inc.

IPC Standards for Manufacturing & Assembly - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post3186.html

: 20 Jul 2012 Location: Hollister, CA Status: Offline Points: 83 Post Options Post Reply Quote rdl86626 Report Post    Thanks(1)    Quote    Reply Posted: 08 Mar 2013 at 8:35am Hi,   We use IPC-A-600, IPC-4101, IPC- 6011, IPC-6012, IPC-6013, IPC-SM-840 FOR FABS Assembly's only IPCF-STD-001

PCB Libraries, Inc.

Copper Elongation and Tensile Strength Requirements - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/copper-elongation-and-tensile-strength-requirements

. The place to find that information in IPC documents is in IPC-4101, Specification for Base Materials and Rigid and Multilayer Printed Boards

Copper Elongation and Tensile Strength Requirements - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/copper-elongation-and-tensile-strength-requirements/

. The place to find that information in IPC documents is in IPC-4101, Specification for Base Materials and Rigid and Multilayer Printed Boards

We Have a Winner! IPC 2012 New England Hand Soldering Competition

| https://www.eptac.com/blog/we-have-a-winner-ipc-2012-new-england-hand-soldering-competition

. In First place, the winner of $500 and a trip to San Diego, CA to compete in the IPC 2013 Hand Soldering Championship, with a score of 99 out of 100 and a time of 22 minutes and 5 seconds, (Gail

Reliability of Reworked Lead-free Assemblies - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/reliability-of-reworked-lead-free-assemblies

. The intent is based upon IPC-4101 and whether or not leaded solder or lead-free solder is being used. You state “…Our present process: 2 heat excursions, thru reflow, 2 thru wave, one thru rework

We Have a Winner! IPC 2012 New England Hand Soldering Competition - EPTAC - Train. Work Smarter. Suc

| https://www.eptac.com/we-have-a-winner-ipc-2012-new-england-hand-soldering-competition/

. In First place, the winner of $500 and a trip to San Diego, CA to compete in the IPC 2013 Hand Soldering Championship, with a score of 99 out of 100 and a time of 22 minutes and 5 seconds, (Gail

Reliability of Reworked Lead-free Assemblies - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/reliability-of-reworked-lead-free-assemblies/

. The intent is based upon IPC-4101 and whether or not leaded solder or lead-free solder is being used. You state “…Our present process: 2 heat excursions, thru reflow, 2 thru wave, one thru rework

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