Industry News | 2016-01-17 19:26:58.0
In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.
Industry News | 2014-09-06 17:51:35.0
IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies.
Industry News | 2024-04-15 10:54:59.0
IPC J-STD-001 and IPC-A-610 cover printed board assembly process controls, materials, and post-assembly acceptance criteria for the electronics industry
Industry News | 2020-02-18 15:10:01.0
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Industry News | 2014-05-22 11:36:25.0
Indium Corporation's Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.
Industry News | 2015-10-30 15:33:26.0
Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.
Industry News | 2012-07-26 09:54:31.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will sponsor and participate in the second annual IPC Midwest Soldering competition held in conjunction with the IPC Midwest Exhibition & Conference
Industry News | 2014-04-18 21:23:36.0
Indium Corporation technology experts will serve as session chair and give a poster presentation at IMAPS New England May 6 in Boxborough, Mass.
Industry News | 2021-03-30 11:44:23.0
Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15.
Industry News | 2008-04-07 20:17:14.0
ITASCA, IL � February 29, 2008 � Kester announces it will showcase EnviroMark 923 (EM923), a halogen-free, RoHS Compliant lead-free no-clean solder paste, in booth 2C04 at the upcoming NEPCON China/EMT China 2008 exhibition and conference -scheduled to take place April 8-11, 2008 in Shanghai, PR China.
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