Industry News | 2010-03-03 14:23:04.0
Indium Corporation announces that 20 of its employees from R&D, Technical Support and Applications Development received their certification in IPC-A-610D, Acceptability of Electronic Assemblies.
Industry News | 2011-04-29 18:08:57.0
Indium Corporation Technical Support Engineer Ed Briggs will present his technical findings at SMTA Toronto Expo and Tech Forum, Toronto, Canada, May 5, 2011.
Industry News | 2011-05-06 22:01:15.0
Indium Corporation Senior Technical Support Engineer Chris Nash will present his technical findings at SMTA's Capital Chapter meeting on May 17, 2011, at Johns Hopkins University's Applied Physics Laboratory in Laurel, MD.
Industry News | 2011-06-01 21:14:28.0
Indium Corporation Senior Technical Support Engineer Chris Nash will present his technical findings at the Huntsville SMTA Expo and Tech Forum on June 22, in Huntsville, AL.
Industry News | 2014-05-22 11:36:25.0
Indium Corporation's Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.
Industry News | 2022-01-29 13:20:07.0
Durafuse™, Indium Corporation's award-winning mixed-alloy technology, will be the focus of a virtual presentation by Dr. HongWen Zhang for the Institution of Engineers, Malaysia at 8 a.m. New York/9 p.m. Malaysia on Thursday, Feb. 24.
Industry News | 2020-12-10 17:23:10.0
Indium Corporation's Dr. Hong Wen Zhang, R&D Manager, Alloy Group, will share his industry expertise during the IEEE Electronics Packaging Society (EPS) Malaysia Chapter Webinar Series at 9 a.m. Malaysia Time, Wednesday, Dec. 16 (8 p.m. Eastern Time, Tuesday, Dec. 15).
Industry News | 2014-04-18 21:23:36.0
Indium Corporation technology experts will serve as session chair and give a poster presentation at IMAPS New England May 6 in Boxborough, Mass.
Industry News | 2015-10-30 15:33:26.0
Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.
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