Industry Directory | Manufacturer
Scienscope supplies inspection equipment, including stereo zoom microscopes, video an X-Ray inspection equipment, automated optical inspection systems, magnifiers, measurement systems.
New Equipment | Education/Training
Failure Analysis Techniques for Electronics provides an overview of the characterization methods available at ACI Technologies, Inc. for determining the causes of failure in electronics devices. This publication will assist the reader in making inf
New Equipment | Fabrication Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board
Electronics Forum | Fri Sep 21 10:35:37 EDT 2012 | davef
Flash gold is just thin electrolytic gold plating over electroless nickel or electrolytic nickel. Flash gold plating ... * Less than 3 microinch thick will be porous and take solder poorly * Greater than 10 microinch thick will cause brittle solder c
Electronics Forum | Mon Sep 24 10:07:46 EDT 2012 | eezday
The answer, as stated above, is 3 microinch's however, it is equaly important, if not more important, to understand that the only function of the gold is to protect the surfaces beneath it. Only enough gold to cover the nickel beneath it should be u
Industry News | 2016-11-30 14:47:45.0
ACI Technologies invites you to download a free copy of its very popular e-booklet, “Failure Analysis Techniques for Electronics” from its Website store, which is located at http://store.aciusa.org/Failure-Analysis-Techniques-for-Electronics-Digital-Download-P181.aspx
Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Career Center | faridabad, India | Engineering,Production,Quality Control
My technical proficiency is extensive and is summarized on my resume (attached). As reflected on my resume (attached) I have completed my B-tech this Year.I am a fresher Electronics Engineer but having 6 months of PCB Assembling,PCB Manufacturing and
Career Center | faridabad, India | Engineering,Production,Quality Control
My technical proficiency is extensive and is summarized on my resume (attached). As reflected on my resume (attached) I have completed my B-tech this Year.I am a fresher Electronics Engineer but having 6 months of PCB Assembling,PCB Manufacturing and
-free soldering, established trends of increasing function
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/10/Reflow-Soldering-2020.pdf
) delivers high-performance and unmatched customer value through its reflow soldering technology. The company pioneered convection reflow soldering in the 1980s, and since then, Heller has set the gold standard for SMT reflow ovens, continuing to refine its systems to satisfy advanced application requirements
| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
