New Equipment | Education/Training
This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac
IPC 6012 Qualification and Performance Specification for Rigid Printed Boards This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or withou
Electronics Forum | Tue Jan 30 20:38:32 EST 2007 | davef
NASA Internal Advisory: NASA-Issued Return to Flight Wristbands Contaminated with Silicone [snip] 10. PROBLEM DESCRIPTION: Recently we have been made aware of a silicone problem associated with the "Return to Flight" wristbands. These wristbands are
Electronics Forum | Thu Jun 25 09:53:04 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | Mike, | You
Industry News | 2010-10-07 13:23:20.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 3 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Industry News | 2012-10-24 17:38:52.0
IPC and SMTA jointly announce the agenda for the Conformal Coating technical workshop to be held on Tuesday November 13, 2012 from 8 a.m.-12 p.m. during the IPC/SMTA Higher Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Technical Library | 2021-08-11 01:00:37.0
Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.
SMTnet Express, February 6, 2020, Subscribers: 33,800, Companies: 10,971, Users: 25,576 Accurately Capturing System-Level Failure of Solder Joints Credits: DfR Solutions Consortium Projects - Thermal Cycling Reliability Consortium projects allow
SMTnet Express, October 17, 2019, Subscribers: 32,268, Companies: 10,900, Users: 25,212 Effect Of Voids On Thermo-Mechanical Reliability of Solder Joints Credits: Alpha Assembly Solutions Despite being a continuous subject of discussion
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
. Aging at elevated temperature alters the structural and mechanical properties of the solder joint and leads to the coarsening of the precipitates in the bulk solder and growth of the intermetallic
| https://www.eptac.com/soldertips/soldertips-avoiding-the-creation-of-splices-via-wire-twisting/
. The reason we do not twist wires to create splices is that it may affect the reliability of the solder joint. Over stress may crack and separate this type of splice
