New SMT Equipment: joint outgassing (1)

Bob Willis Electronics Assembly Video Library

Bob Willis Electronics Assembly Video Library

New Equipment | Education/Training

Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for

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Electronics Forum: joint outgassing (25)

Wave solder joint on PTH part

Electronics Forum | Mon Jan 15 18:24:40 EST 2007 | greg york

probably volatiles in the joint outgassing as it comes over the wave, is the joint a yellowy colour as well, or any pictures we can view cheers greg

Re: BGA Void

Electronics Forum | Wed Mar 29 09:39:45 EST 2000 | JAX

Garo, Minor voiding in Ball Grid Array solder joints is common, and not considered a threat to reliability. The biggest cause of open solder joints caused by voids is the outgassing of moisture. They are formed when pockets of gas are trapped durin

Industry News: joint outgassing (11)

IPC & SMTA’s High-Reliability Cleaning & Conformal Coating Conference Continues with a Presentation Dedicated to Reliability & Ruggedness

Industry News | 2016-09-15 18:08:04.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

Association Connecting Electronics Industries (IPC)

IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS

Industry News | 2011-08-18 21:23:09.0

For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.

Association Connecting Electronics Industries (IPC)

Technical Library: joint outgassing (2)

A Novel Solution for No-Clean Flux not Fully Dried under Component Terminations

Technical Library | 2017-08-17 12:28:30.0

At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints

Indium Corporation

Pad Design and Process for Voiding Control at QFN Assembly

Technical Library | 2024-07-24 01:04:35.0

Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.

Indium Corporation

Training Courses: joint outgassing (1)

Void Formation in Solder Joints - Causes & Cures - Online Webinar

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

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Express Newsletter: joint outgassing (222)

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

Partner Websites: joint outgassing (5)

Bubbles and Conformal Coating

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/bubbles-and-conformal-coating

. Let’s take a look at the IPC standards. IPC Standards IPC-HDBK-830 – Long Term Reliability and Testing Section 12.1.5 – Bubbles The presence of bubbles in a conformal coating is a factor in air entrapment, outgassing, mixing and/or application methods

ASYMTEK Products | Nordson Electronics Solutions


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