Industry Directory: jot 1/2 meter (1)

Shenzhen Shunyuan Tapes Co.,Ltd.

Shenzhen Shunyuan Tapes Co.,Ltd.

Industry Directory | Adhesives / Dispensing / Component Packaging / Tape and Reel Services / OEM

Providing Belting/Sequencing Tape for Electronics Industry,bandoliering tape 6mm*3000m,thermal melting tape,active and passive component processing,axial taping and radial lead forming for capacitor,LED diode

New SMT Equipment: jot 1/2 meter (4560)

Simatic S5 Cable - 1.5 meter 6ES5721-0BB50

Simatic S5 Cable - 1.5 meter 6ES5721-0BB50

New Equipment | Industrial Automation

Welcome to us for a QUOTE. (Unik) +86 18030205725 (skype/ whatapp/ wechat)                    Quick Details     ²   In stock ²   MOQ 1 Pcs ²   100% new factory sealed ²   Warranty: 12 months ²   

Cambia Automation Limited

Siemens Simatic S5 Cable - 2.5 meter 6ES5721-0BC50

Siemens Simatic S5 Cable - 2.5 meter 6ES5721-0BC50

New Equipment | Industrial Automation

Welcome to us for a QUOTE. (Unik) +86 18030205725 (skype/ whatapp/ wechat)                    Quick Details     ²   In stock ²   MOQ 1 Pcs ²   100% new factory sealed ²   Warranty: 12 months ²   

Cambia Automation Limited

Electronics Forum: jot 1/2 meter (6)

SMT Connecting Conveyors

Electronics Forum | Tue May 06 07:29:10 EDT 2008 | cyber_wolf

I am looking at NEW connecting conveyors for our Fuji lines. So far I have looked at Simplimatic,Promation,and Jot. There seems to be a large spread in pricing. Has anyone out there purchased new conveyors lately..if so what is your take on it ? I

Electrostatic Discharge due to Compressed Air

Electronics Forum | Thu Jul 07 01:26:34 EDT 2016 | lukvel

I have not tested whether there is electrostatic discharge on the PCB or not because the electrostatic meter is still on its way. But the IPC-A-610 section 3.1.2 specifies that yes even compressed air nozzles that move air over insulating surfaces g

Used SMT Equipment: jot 1/2 meter (50)

Industry News: jot 1/2 meter (15)

2-Part Mixing is now Volumetric Dispensing!

Industry News | 2017-06-14 10:46:29.0

GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.

GPD Global

Seika Machinery Offers Discount on McDry PCB Storage Cabinets to Help Customers Meet IPC Storage Guidelines

Industry News | 2012-06-25 12:38:27.0

Seika Machinery, Inc. announces a special sale to assist its customers with meeting the IPC 1601 PCB Storage and Handling Guideline

Seika Machinery, Inc.

Parts & Supplies: jot 1/2 meter (33)

Reinhardt Resistance Tester OHM meter for E Cigarette 510 Thread RDA RBA DIY vaporizer

Reinhardt Resistance Tester OHM meter for E Cigarette 510 Thread RDA RBA DIY vaporizer

Parts & Supplies | SMT Equipment

Resistance Tester OHM meter for E Cigarette 510 Thread RDA RBA DIY vaporizer Specifications: Resistance Range: 0-20ω Voltage Range: 0-6V Power Supply: 2 * 1.5V AA Battery(not included) Item Size: 6.7 * 4.6 * 1.6cm / 2.6 * 1.8 * 0.6in Item Weig

KingFei SMT Tech

Juki JUKI SMT feeder: JUKI CF03HP feeder

Juki JUKI SMT feeder: JUKI CF03HP feeder

Parts & Supplies | Pick and Place/Feeders


KingFei SMT Tech

Technical Library: jot 1/2 meter (58)

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.


Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Videos: jot 1/2 meter (11)

ASCEN Technology

LED PCB separator


PCB separator

aluminum PCB separation

ASCEN Technology

aluminum LED separator


PCB separator

aluminum PCB separator

Career Center - Resumes: jot 1/2 meter (2)

SMT Production/Maintenance engineer

Career Center | Alexandria, Egypt | Engineering,Maintenance,Management,Technical Support

I am an adaptable and fast learner person, I have an experience of 5 years at manufacturing and management of people, a good team player who can communicate with others to get and give the best he can for the working place, I want to develop my self

Equipment Engineer\B Tech (EC)\7.5+ Years Ex

Career Center | Dargaha Road Zameen Pallavaram Chennai, Tamilnadu India | Maintenance,Technical Support

CURRENT JOB: • Responsible for four sub department as Production support, Preventive maintenance activity, Spare parts control and NPI (New product Introduction) under one Equipment department. • Take care of OEE (Overall Equipment Efficiency), MTTR

Express Newsletter: jot 1/2 meter (89)

Partner Websites: jot 1/2 meter (4051)

488 2-Komponenten Shot Meter Serie

Nordson ASYMTEK |

Applikatoren für JetStream-Kartuschen-Dispenser Angstrom Metersystem Pro-Meter A2K Pro-Meter D2K Pro-Meter H2K 488 2-Komponenten Shot Meter Serie 305 1-Komponenten Shot-Meter Program-A-Bead 3 1-Komponenten Shot





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