Industry News: kleenox and powder (Page 1 of 5)

International Conference on Soldering and Reliability

Industry News | 2011-01-18 13:20:51.0

Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference will bring together the community of soldering and reliability experts. Show off the expertise of your company by presenting a paper.

Surface Mount Technology Association (SMTA)

Newly Updated IPC-AJ-820A Provides Nitty-Gritty of Electronics Assembly and Soldering

Industry News | 2012-03-21 17:42:19.0

For many designers and manufacturing personnel in the electronics manufacturing supply chain, IPC-AJ-820, Assembly and Joining Handbook, is the document of choice for all aspects involved in creating a PCB.

Association Connecting Electronics Industries (IPC)

Call for Papers: International Conference on Soldering and Reliability

Industry News | 2010-01-22 21:37:52.0

Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference will bring together the community of soldering and reliability experts. Show off the expertise of your company by presenting a paper.

Surface Mount Technology Association (SMTA)

SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

Industry News | 2017-05-15 16:35:00.0

SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

Christopher Associates Debuts S3X-BF70M and 200N Series Wafer Bumping Pastes

Industry News | 2010-12-01 15:42:43.0

Christopher Associates introduces the S3X-BF70M and 200N series wafer bumping pastes. The pastes exhibit a high definition over time and at elevated temperatures.

Christopher Associates Inc.

Indium Corporation Expert to Present at International Conference on Soldering and Reliability

Industry News | 2014-05-06 10:43:05.0

Indium Corporation's Ed Briggs, senior technical support engineer, will present at the International Conference on Soldering and Reliability Wednesday, May 14 in Toronto, Canada.

Indium Corporation

Co-Location Creates Nation�s Largest Design and Mfg. Event

Industry News | 2006-07-12 14:18:04.0

Assembly Expo, Quality, and National Manufacturing Week to combine in Chicago

UBM Canon

Nordson Enhances Electronic Test and Inspection Capabilities

Industry News | 2010-08-19 02:11:40.0

Nordson Corporation announced that it has formed a test and inspection group within its Advanced Technology segment to better leverage the competencies of its Nordson DAGE and Nordson YESTECH subsidiaries.

Nordson Corporation

Sovella Concept Workstations Maximize Performance and Productivity

Industry News | 2013-05-02 14:29:17.0

As a leading manufacturer of industrial workbenches and accessories, Sovella continually seeks to improve and perfect our wide range of products, and provide solutions that best meet the needs of our users. With those needs in mind, Sovella's Concept workstation was developed.

Treston Inc.

Parvus� PC104+DEV� Development Platform Offers Flexibility and Convenience for Embedded Software and Hardware Developers

Industry News | 2004-07-19 11:24:45.0

Parvus unveils benchtop development station for use with PC/104, PC/104-Plus, ISA and PCI computer boards

Parvus Corporation

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