Electronics Forum | Sat Jun 15 22:49:23 EDT 2002 | edahi
well as usual this for flip chip however, this application uses ceramic substrates and the nearby area in which the splatter land on is the marking area (gold pad). We cannot hide this because the package is completed bare die, meaning no heatspread
Electronics Forum | Thu Oct 04 00:03:28 EDT 2018 | gaintstar
flason smt pick and place machine: http://www.flason-smt.com/product/Hanwha-IC-placer-SM321-High-Speed-SMT-Modular-Chip-Mounter.html http://www.flason-smt.com/product/Hanwha-Pick-and-Place-Machine-DECAN-F2-High-Speed-SMT-Modular-Chip-Mounter.html htt
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