Electronics Forum | Fri Nov 17 07:58:06 EST 2006 | markb
SWAG - I also forgot to mention a few things. Our delmaination was always between the large copper plane and the laminate. It is a multi-layered board, so even when the delamination appeared around components (through visual inspection), cross-sect
Electronics Forum | Thu Nov 16 11:45:15 EST 2006 | markb
I still think the best bet is probably an SMT pre-bake operation to ensure that there is no moisture in the board. Vapor pressure is usually the leading cause for delamination, so removing the source should significantly help out. Unfortuantely, pr
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. Aspandiar characterized and classified BGA solder joint voids into several categories with assigned root causes that are widely utilized as ‘the
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