New Equipment | Solder Paste Stencils
Solder Paste Printing Stencils The industry standard to manufacture solder paste stencils is to use Yag lasers with the capability to cut to a tolerance of +/- .0002". Stentech, with 12 Yag lasers across North America, can provide you the quality an
Automated 3D paste inspection for print process characterization, control and early defect prevention Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is th
Electronics Forum | Thu May 13 17:31:48 EDT 2021 | bandjwet
We have a PCB rework dilemma involving a reflow profile. This is a SAC305/Low Solids (aka no clean) process where we are currently hand soldering (5) components that were DNP. The boards have an acrylic coating and we take off the acrylic at the par
Electronics Forum | Thu Apr 06 15:47:09 EDT 2006 | jbrower
Last week I had the opportunity to get a sample of AIM SN100C solder paste. The SN100C paste was very nice to work with. My initial observations was that the paste had a very light odor, much less than the Alpha UP78 paste that we are currently
Used SMT Equipment | Pick and Place/Feeders
Product name: KE - 2060L JUKI chip mounter Product number: KE - 2060L JUKI2060 chip mounter parameters: Mounting head: 3 Material stand: 80 Mount speed: 0.25 SEC/CHIP (3 head at thesame time put in the attached SMT) Mounting speed:+ / - 0.. 5 M
Used SMT Equipment | SMT Equipment
Product name: KE - 2060 l JUKI chip mounter Product number: KE - 2060 l JUKI2060 chip mounter parameters: Mounting head: 3 Material stand: 80 Mount speed: 0.25 SEC/CHIP (3 head at the same time put in the attached SMT) Mounting speed:+ / - 0.
Industry News | 2014-11-25 17:00:13.0
FCT Assembly announces that the A-Laser Division will discuss its new laser direct structuring (LDS) capability in Booth #235 at the BIOMEDevice Show, scheduled to take place December 3-4, 2014 at the San Jose Convention Center in California. The introduction of laser direct structuring (LDS) has revolutionized the molded interconnect device (MID) market, bringing flexibility to design and enhancing product capability.
Industry News | 2004-06-10 15:42:07.0
New solution uses wireless DISTO� laser and Windows� mobile computers to improve productivity by up to 1000%
Parts & Supplies | Pick and Place/Feeders
PG00975 PACKING PH00990 PACKING NXT (first generation / second generation /) original brand new V12 H12HS H12S H08 HEAD original brand new NOZZLE! ! NXT 0.3mm 0.4mm 0.5mm 0.7mm 0.8mm 1.0mm 1.3mm 1.8mm NOZZLE NXT 1.3ML 1.8ML 2.5mm 3.7mm 3.7G 5.0mm
Parts & Supplies | Pick and Place/Feeders
H66817 NXT3 4M Vacuum Pump DOP-400SA Maintenance Kit .AA6SB05 REFERENCE PIN 2.2MGKSA003602 ROLLER (OF AJ92609 HARNESS) 3.A5053C O-RING 4. 2MGKHA014800 O-RING 5 .A5188Z O-RING PIA (4.0*1.0(FKM70)) 4.2SGKZC001300 5.XS03690 7.2MGKHA03510* NXT se
SMTnet Express, September 12, 2019, Subscribers: 32,222, Companies: 10,879, Users: 25,108 Investigation of Cutting Quality and Mitigation Methods for Laser Depaneling of Printed Circuit Boards Credits: LPKF Laser & Electronics There are numerous
KingFei SMT Tech | http://www.smtspare-parts.com/sale-9527585-x01l5201402-clinch-shaft-for-rhs-rl131-rl132-ai-machine-n610135836aa-a-i-parts.html
Spare Parts SMT Feeder SMT Feeder Parts SMT Nozzle SMC Air Cylinder SMC Solenoid Valve Cyberoptics Laser Sensor Servo Motor Driver SMC Filter Elements SMT Conveyor Belt SMT PCB Assembly Screen Printing
