Electronics Forum | Mon Nov 02 14:45:25 EST 2015 | stevezeva
Hi there! If they are just standard headers there's a company called Teka that makes headers and socket headers with solder preforms in them. They call it "Solder Bearing Lead Technology" You can drop them in the board and reflow them just like SMT p
Electronics Forum | Tue Jul 01 12:22:09 EDT 2008 | gpe.
Hi, I have a question fou you guys: Is there any difference between LCC's and QFN's? or, Are those just two terms to call the same part? Thanks for your help. Gpe.
Electronics Forum | Tue Jul 01 13:35:49 EDT 2008 | realchunks
QFNs have pads on the bottom. LCCs have pads on the sides that are exposed on the bottom.
Electronics Forum | Tue Jul 01 13:40:32 EDT 2008 | gencinas
Thanks Real Chunks. Gpe.
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Thu May 13 09:52:34 EDT 2021 | winston_one
Want to update this question a little, I know it appears few years ago, but I hope there is some updates... We have to assembly few samples of motherboards with this kind of finish (customer mistake during pcb order). Normally we can use leaded sold
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Electronics Forum | Thu Aug 31 14:15:34 EDT 2023 | compit
Hello What feeder do you use for the long connector (65-80mm) - tape feeder, tray? What nozzles? We want to mount a SODIMM200 socket. I don't know whether to look on the tape or on the trays... The MG1 spec says it will mount connectors up to 100mm (
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce