Our experienced engineers and technicians can craft processes that require a variety of surface mount technology (SMT) and plated through-hole (PTH) assembly techniques. ACI can assist manufacturers that require process development with solder alloy
New Equipment | Education/Training
IPC J-STD 001 REV F Requirements for Soldered Electrical and Electronic Assemblies. The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released August 2014. IPC J-STD-001
The KICstart²™ thermal profiler utilizes core technologies developed by KIC, the world’s premier thermal profiling company, and is supported by KIC’s worldwide organization. Packaging these innovative technologies into a low-cost system, the KICstart
Desktop covenyor Reflow Oven R350 from prototyping to full production. Desktop covenyor Reflow Oven R350 from prototyping to full production. Product Description Introduction: R350 mini reflow oven R350 is the first inline lead free reflow oven
SunzonTech’s SER-710N reflow-soldering oven is the space-saving and inexpensive solution for most of standard SMT soldering process. Space saving and low energy consumption, the machine has lots advantage of a larger reflow-soldering oven such
Click here to view the SlimKIC 2000 datasheet Profiling So Easy, Anyone Can Do It By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select fro
Click here to view the SlimKIC 2000 datasheet Profiling So Easy, Anyone Can Do It By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select fro
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Process Capability: Several professional auto Siemens series Siplace SMT placement and the plated-through-hole(PTH) insertion parts, test, package lines Productivity: mount above 1.5million/day SMC components in our SMT production lines Small SMC/
Process Capability: Several professional auto Siemens series Siplace SMT placement and the plated-through-hole(PTH) insertion parts, test, package lines Productivity: mount above 1.5million/day SMC components in our SMT production lines Small SMC/
