Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Electronics Forum | Sun Sep 23 18:59:59 EDT 2007 | darby
I presume you are looking at low melting point solders. Firstly, I would consider running BOTH sides with the same paste - this will cut down the opportunities for a mix up with rework or retro-fit. Secondly, check that there is a cored wire availabl
Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam
We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l
Used SMT Equipment | Soldering - Reflow
2013 Heller Industries 1809 MKIII 9 Zone Lead Free Reflow Oven Make: Heller Model: 1809 MKIII Vintage: 2013 Description: Lead Free Reflow Oven Details: 9 Zone Heating / 2 cooling zones Left to right Combo Conveyor &nd
Used SMT Equipment | Soldering - Selective
This machine will be coming available for purchase soon. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: Version
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Parts & Supplies | Pick and Place/Feeders
1. SMT equipment original/imitation accessories sales: Fuji, Juki, Yamaha, Samsung, Panasonic, and other equipment suction nozzle, Feida and accessories, suction Rod, Suction nozzle Rod, sensor, cutter, belt, filter cotton, sensor, light module, sole
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Nano-copper sintering in formic acid vapor.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Rochester, New York USA | Engineering
Job Description: Implements and analyzes manufacturing engineering plans and projects. Designs, develops and transfers manufacturing and engineering tools, strategies and systems. Develops manufacturing strategies for specific products and processes
Career Center | , Alabama Saudi Arabia | Engineering,Production,Research and Development
SNR MANUFACTURING ENGINEER WANTED Design Change Management and New product Introduction. Solder paste printing process (knowledge of Fuji screen printer machines. Stencil design/ modification and the use of Gerber data. SMT placement machines (Kno
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
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