Industry Directory | Distributor
Mayer Alloys stocks and supplies a complete line of tin and lead based alloys and lead free alloys.
Industry Directory | Manufacturer
manufactures solder preforms , hermetic covers , heat spreaders and custom welded assembllies
New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Electronics Forum | Thu Jul 20 15:47:29 EDT 2000 | William
Bob, what alloy is leading the pack for sn-pb replacement. Will this alloy adapt itself to component leads? What circuit board finishes will we be dealing with?
Electronics Forum | Thu Jul 20 16:04:22 EDT 2000 | Bob Willis
Tin/silver/copper is the alloy I have done most with and it would seem that it will be the alloy of choice if you look at the people doing the work. There are still some issues of fillet lifting which I have seen on PIHR soldering and the same in wav
Used SMT Equipment | Soldering - Selective
Make: Nordson Model: Select Novo 102 Vintage: 2020 Description: Selective Solder Details: Lead-Free Titanium Solder Pot & Pump Assembly Solder Pot Capacity: 30 lbs Software: SWAK-OS 4.0 (Includes Automated Fiducial Alignment, Board Warp Compensa
Used SMT Equipment | Soldering - Wave
The machine is too big for our purposes. We currently utilize a much smaller wave machine, as our manufacturing operation is mainly SMT. This machine was using leaded alloys. The last time it was operational it was in normal working order. The pot is
Industry News | 2010-06-04 16:23:16.0
BANNOCKBURN, Ill., USA — The IPC Solder Products Value Council (SPVC) has published a free white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for the evaluation of new lead-free alloys on the basis of their physical properties. Developed in cooperation with leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) companies, the white paper will help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.
Industry News | 2011-08-30 19:41:37.0
The SMTA announced two sessions on Alternate Lead-Free Alloys featured during their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Parts & Supplies | Pick and Place/Feeders
Advantages of JUKI electric feeder With the electronic parts more sophisticated, more and more small, the use of electric feeder has become the standard placement of the placement machine, the old placement machine can use electric feeder has becom
Parts & Supplies | Assembly Accessories
Electrical ： Current Rating (Amps): 6 Average Probe Resistance (mOhm): 10 Materials & Finishes ： Barrel Material: Work-hardened Phosphor Bronze, Gold plated over hard Nickel Plunger Material: High performance alloy, LFRE proprietary plati
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2007-08-16 13:34:31.0
While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" (Figure A) and "graininess and lack of shininess of the solder joint" (Figure B) are typical comments about some lead-free solder joints. However, in cases where a Nitrogen atmosphere was present during the reflow of the solder joint (Figure C), there will be little visual differences between the lead free alloys and their tin-lead counterparts.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ON DEMAND | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | San DIego (Mira Mesa), California USA | Engineering,Maintenance,Production
Duties: Supports, develops and optimizes manufacturing processes. Reviews quality metrics to help produce high quality, repeatable processes. Assists with supporting and improving the SMT process (print process, placement, reflow, package-o
Career Center | Greenville, South Carolina USA | Engineering,Management,Production,Purchasing,Quality Control
Job Purpose Develop the next generation, leading edge products for GE Energy customers. As an Advanced Manufacturing Engineer supporting Gas Turbines, you will: Work in a highly cross-functional environment with Engineering, Manufacturing, Sourci
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
SMTnet Express, January 10, 2019, Subscribers: 31,583, Companies: 10,684, Users: 25,588 An Investigation into Lead-Free Low Silver Cored Solder Wire for Electronics Manufacturing Applications Credits: Koki Company LTD The electronics industry has
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. ALLOY TEMPERATURE GUIDE LEADED ALLOYS LEAD-FREE ALLOYS Alloy Solidus (° C) Liquidus (° C) Alloy Solidus (° C) Liquidus (° C) Sn43 Pb43 Bi14 144 163 Sn42 Bi57
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
) than the leaded products they replaced. However, one issue did escape this qualification process. Over time it was discovered by Dell [8] and others [9, 10, 14
winsouce.jpg)
.gif)
