Industry Directory: leaded bga with rohs process (10)

Link 2 Manufacturing Inc.

Link 2 Manufacturing Inc.

Industry Directory |

Consigned and Turnkey solutions for Contract Electronic Manufacturing

Winslow Automation (aka Six Sigma)

Winslow Automation (aka Six Sigma)

Industry Directory | Service Provider

Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.

New SMT Equipment: leaded bga with rohs process (30)

NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

New Equipment | Dispensing

The NexJet® 8 Jetting System with ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. ReadiSet Jet Cartridge reduces operator training time, cost-of-ownership, and

Nordson ASYMTEK

Full Hot Air Lead-Free Reflow Oven with PLC A800

Full Hot Air Lead-Free Reflow Oven with PLC A800

New Equipment | Reflow

Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated

Shenzhen ETA Technology Co., Ltd

Electronics Forum: leaded bga with rohs process (49)

Question about leaded parts used in leadfree soldering process

Electronics Forum | Fri Apr 07 11:19:55 EDT 2006 | muse95

Technically speaking, most likely yes it will work, unless possibly it is a BGA. There are issues surrounding BGA's. Here are some of the general issues: On any type of component, if the Pbfree solder you are using contains bismuth, then the Pb in

Question about leaded parts used in leadfree soldering process

Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir

Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent

Used SMT Equipment: leaded bga with rohs process (1)

Active Technologies pcba1

Active Technologies pcba1

Used SMT Equipment | Conveyors

PCBA manufacturer. Our company is engaged in Reliable OEM / ODM PCBA assembly services for electronic applications. Main Products and services: PCBA (Printed Circuit Board Assembly) 1. The high standard workshops for SMT, Dipper, and Assembling en

PULANG TECHNOLOGY CO,.LTD

Industry News: leaded bga with rohs process (104)

MIRTEC Awarded AOI Contract with ACD at Productronica 2011

Industry News | 2011-12-14 16:19:46.0

MIRTEC announces that ACD purchased two Mv-7xi In-Line AOI Systems during the recent Productronica Trade Fair in Germany. ACD has very high inspection standards and the new MV-7xi AOI systems will help the company continue to meet or exceed those requirements.

MIRTEC Corporation

ÉOLANE upgrades their printing process with Speedprint’s AVI platform to manage the most demanding technical applications

Industry News | 2013-09-03 14:27:38.0

The ÉOLANE Group is the 4th largest European electronic subcontractor, currently employing 3,000 personnel across 20 European facilities, with 10 sites manufacturing in France.

Speedprint Technology

Technical Library: leaded bga with rohs process (57)

Pad Cratering

Technical Library | 2020-05-08 18:22:31.0

A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.

ACI Technologies, Inc.

Pad Cratering

Technical Library | 2020-05-08 18:22:31.0

A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.

ACI Technologies, Inc.

Videos: leaded bga with rohs process (5)

Manual PCB cleaning with VIGON EFM

Manual PCB cleaning with VIGON EFM

Videos

VIGON® EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. VIGON® EFM is a mixture of halogen-free, organic solvents. It dries fast and residue-free. VIGON® EFM is non-corrosive and co

ZESTRON Americas

NexJet NJ-8 System with ReadiSet Jet Cartridge

NexJet NJ-8 System with ReadiSet Jet Cartridge

Videos

The NexJet® 8 System with ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. Read more at http://www.nordsonasymtek.com/nexjet

Nordson ASYMTEK

Training Courses: leaded bga with rohs process (1)

Design and Manufacturing with SMT-BGA-BTC

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

Ray Prasad Consultancy Group

Career Center - Resumes: leaded bga with rohs process (4)

mb20b

Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support

Engineer with a diverse background in management, quality, computer and customer service.  Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m

mb20c

Career Center | , Minnesota | Engineering,Management,Production,Quality Control,Technical Support

Engineer with a diverse background in management, quality, computer and customer service.  Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m

Express Newsletter: leaded bga with rohs process (972)

New BGA Solder Mask Repair Technique Using Laser Cut Stencils

New BGA Solder Mask Repair Technique Using Laser Cut Stencils If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ New BGA Solder Mask Repair Technique Using Laser Cut Stencils Best, Inc

SMTnet Express - December 19, 2013

SMTnet Express, December 19, 2013, Subscribers: 26421, Members: Companies: 13524, Users: 35538 Mixed Metals Impact on Reliability by Rick Gunn; Nextek With the adoption of RoHS and implementation of Lead Free solders a major concern is how

Partner Websites: leaded bga with rohs process (128)

Semi-aqueous PCBA Cleaning – a combined process

ZESTRON Americas | https://www.zestron.com/en/cleaning-applications/smt-electronics-cleaning/pcb-cleaning/semi-aqueous-cleaning-process.html

. Semi-aqueous PCBA cleaning processes feature a very wide process window that facilitates the removal of all types of resin and flux residues from lead-free and leaded no-clean solder pastes

ZESTRON Americas

Comh-Iontaofacht Solder Eagar Eangaí Ball Sn-Ag-Cu saor ó Pb (BGA) Comhpháirteanna i bPróiseas Tionó

ShenZhen J-wide Electronics Equipment Co.,Ltd | https://www.jwide-smt.com/ga/solder-joint-reliability-of-pb-free-sn-ag-cu-ball-grid-array-bga-components-in-sn-pb-assembly-process/

. Teanga English /solder-joint-reliability-of-pb-free-sn-ag-cu-ball-grid-array-bga-components-in-sn-pb-assembly-process/ Español /es/solder-joint-reliability-of-pb-free-sn-ag-cu-ball-grid-array-bga-components-in-sn-pb-assembly-process

ShenZhen J-wide Electronics Equipment Co.,Ltd


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