New Equipment | Assembly Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board
New Equipment | Test Equipment
3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us
Electronics Forum | Tue May 21 15:37:36 EDT 2013 | armelinda
I am looking for a service providing non contact PCB flatness measurement for open board SiP assembly. It was returned for failure analysis with complaint that assembly does not solder properly onto customer system board. Since there are remnants o
Electronics Forum | Tue Nov 28 17:43:03 EST 2006 | IRAS
I'm looking to gain some knowledge on potential causes of solderballs on LGA's and advice on how to eliminate them. we all seeing some solderballs on only the edges of the LGA. Any inputs will be greatful.
Used SMT Equipment | Pick and Place/Feeders
Panasonic AM100 pick and place machine FEATURES ▶Single head (single beam) capable of placing an impressive component array including: 0402mm to 120x90x28mm▶Capable of placing large connectors, odd-shaped components, and advanced packaging types suc
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2016-04-06 12:45:01.0
The SMTA is excited to announce three new workshops for the 10th Annual International Conference on Soldering and Reliability (ICSR) being held May 9-11, 2016 in Toronto, Canada. The event is co-located with the SMTA Toronto Expo.
Technical Library | 2021-12-16 01:48:41.0
Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.
Technical Library | 2019-04-17 21:29:14.0
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
Panasonic AM100 SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/industries/automotive-and-transportation?con=t&page=8
300S has many unique features,… Board Warp Compensation Nordson SELECT Measures board warpage and deflection should circuit board sag during preheating
Lewis & Clark | http://www.lewis-clark.com/product-tag/my500/
=0 2012 Mydata My500 Jet Printer Make: Mydata Model: My500 Description: Jet Printer Vintage: 2012 Details: Software 1.9.3A No Stencil Automatic board stretch and board warpage compensation
winsouce.jpg)
