Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/UserGuide/download/Footprint%20Expert%20Surface%20Mount%20Families.pdf
Rectangular Chip Component Package Sizes Table of Chip Package Size Codes and Dimensions EIA (inch) Name Inch Dimensions IEC (metric) Name Metric Dimensions 01005 0.0157 in × 0.0079 in 0402 0.4 mm × 0.2 mm 0201 0.024 in × 0.012 in 0603 0.6 mm × 0.3
